Printed logic gate
US-2016380634-A1 · Dec 29, 2016 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K2201/42 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 208 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 26 |
| 2016 | 38 |
| 2017 | 72 |
| 2018 | 65 |
| 2019 | 6 |
| 2020 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component
US-9527150-B2 · Dec 27, 2016 · US
Semiconductor device package including bonding layer having Ag3Sn
US-9520377-B2 · Dec 13, 2016 · US
Wire bonding method
US-9508673-B2 · Nov 29, 2016 · US
Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
US-9504841-B2 · Nov 29, 2016 · US
Vacuum transition for solder bump mold filling
US-9498837-B2 · Nov 22, 2016 · US
Solder supply device
US-2016338209-A1 · Nov 17, 2016 · US
Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
US-9496240-B2 · Nov 15, 2016 · US
Gas-blowing-hole array structure and soldering apparatus
US-9485872-B2 · Nov 1, 2016 · US
Power module substrate, power module substrate with heat sink, and power module
US-9480144-B2 · Oct 25, 2016 · US
Leadless multi-layered ceramic capacitor stacks
US-9472342-B2 · Oct 18, 2016 · US
Flux Recovery Device and Soldering Device
US-2016279726-A1 · Sep 29, 2016 · US
Integrate rinse module in hybrid bonding platform
US-9446467-B2 · Sep 20, 2016 · US
Support entering into the fabrication of an electronic device, corresponding memory card connector, memory card read terminal and manufacturing method
US-2016270219-A1 · Sep 15, 2016 · US
Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate
US-9442286-B2 · Sep 13, 2016 · US
Method of manufacturing printed circuit board and printed circuit board
US-9421628-B2 · Aug 23, 2016 · US
Solder joint material and method of manufacturing the same
US-9421645-B2 · Aug 23, 2016 · US
Soldering structure and process of making the same
US-9421644-B2 · Aug 23, 2016 · US
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US-9425162-B2 · Aug 23, 2016 · US
Electrical contacts, fusible members, and methods of attaching electrical contacts to substrates
US-9419354-B2 · Aug 16, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K2201/42?
- CPC B23K2201/42 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B23K2201/42 (Operations & Transport)?
- Our database includes 208 publications tagged with this CPC code.
- Is patent activity under CPC B23K2201/42 growing?
- Publication counts under this code: 6 in 2019 vs 1 in 2020 (latest complete years).