Direct integration of feedthrough to implantable medical device housing with ultrasonic welding

Patent metadata

Field	Value
Publication number	US-9504841-B2
Application number	US-201314104644-A
Country	US
Kind code	B2
Filing date	Dec 12, 2013
Priority date	Dec 12, 2013
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

One aspect provides a method of securing a feedthrough to a metal housing for an implantable medical device. The feedthrough is provided comprising an insulating section and at least one conductive section extending through the insulating section. At least a portion of the insulating section is metalized and the metalized feedthrough is placed within an opening in the metal housing of the implantable medical device. The feedthrough and metal housing are positioning within an ultrasonic welding system and the ultrasonic welding system is energized such that sonic energy welds the feedthrough directly to the metal housing. The temperature of the metal housing is not raised above the β-transus temperature of the metal housing during the ultrasonic welding.

First claim

What is claimed is:

1. A method of securing a feedthrough directly to a metal housing for an implantable medical device, the method comprising:
providing the feedthrough comprising an insulating section and at least one conductive section extending through the insulating section;
metalizing at least a portion of the insulating section;
placing the metalized feedthrough within an opening in the metal housing of the implantable medical device;
positioning the feedthrough and metal housing within an ultrasonic welding system;
placing a bond material between the feedthrough and the metal housing; and
energizing the ultrasonic welding system such that ultrasonic energy welds the feedthrough directly to the metal housing with the bonding material and without any intervening ferrule between the feedthrough and the metal housing, thereby creating a hermetic seal between the feedthrough and housing;
characterized in that the temperature of the metal housing is not raised above the β-transus temperature of the metal housing during the ultrasonic welding.

2. The method of claim 1 wherein positioning the feedthrough and metal housing within the ultrasonic welding system further comprises positioning the feedthrough and metal housing between a first portion and a second portion of the ultrasonic welding system and such that the first portion contacts only the feedthrough on a first side and the second portion contacts only the metal housing on a second side opposite the first side as the first and second portions of the ultrasonic welding system are forced together.

3. The method of claim 1 further comprising placing the bond material between the metalized feedthrough and the metal housing characterized in that the temperature of the metal housing, the metalized feedthrough, and the bonding material is not raised above the β-transus temperature of the metal housing and the metalized feedthrough during the ultrasonic welding.

4. The method of claim 1 , wherein the temperature of the metal housing is kept below 890° C. while the ultrasonic welding system is energized and the feedthrough is welded to the metal housing.

5. The method of claim 1 , wherein the temperature of the metal housing is kept below 750° C. while the ultrasonic welding system is energized and the feedthrough is welded to the metal housing.

6. The method of claim 1 , wherein the temperature of the metal housing is controlled while the ultrasonic welding system is energized and the feedthrough is welded to the metal housing such that the metal housing does not experience significant grain growth.

7. The method of claim 1 , wherein the temperature of the metal housing is controlled while the ultrasonic welding system is energized and the feedthrough is welded to the metal housing such that the microstructure of the metal housing remains primarily α-phase grains having an average grain size of less than 425 μm.

8. The method of claim 1 , wherein the temperature of the metal housing is controlled while the ultrasonic welding system is energized and the feedthrough is welded to the metal housing such that the microstructure of the metal housing remains primarily α-phase grains having an average grain size in the range of 10-40 μm.

Assignees

• Heraeus Precious Metals Gmbh
• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Markham Jacob
• Hausch Ulrich

Classifications

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• B23K20/10

  making use of vibrations, e.g. ultrasonic welding · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title