Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component

Patent metadata

Field	Value
Publication number	US-9527150-B2
Application number	US-201414331585-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Aug 20, 2013
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component.

First claim

What is claimed is:

1. A method for manufacturing a terminal-strip-equipped electronic component, comprising:
a first step of preparing an electronic chip component including terminal electrodes on two opposing end surfaces;
a second step of preparing a pair of terminal strips made of a metal plate;
a third step of applying solder cream to outer surfaces of the terminal electrodes or inner surfaces of the terminal strips;
a fourth step of thermocompression bonding the terminal strips to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to form an electronic component to which the terminal strips are temporarily fixed; and
a fifth step of fully fixing the terminal strips to the electronic component by heating the electronic component to which the terminal strips are temporarily fixed in a heating furnace and melting the solder cream so as to obtain a terminal-strip-equipped electronic component.

2. The method according to claim 1 , wherein, in the fifth step, a plurality of electronic components to each of which the terminal strips have been temporarily fixed are thermally treated at one time.

3. The method according to claim 1 , wherein a maximum temperature during the thermocompression bonding in the fourth step is higher than a maximum temperature during the heating in the fifth step.

4. The method according to any claim 1 ,
wherein a multilayered plating layer including a plurality of layers made of different types of metal is disposed over at least one of a surface of each of the terminal electrodes and a surface of the corresponding strip of the terminal strips, the surfaces opposing each other, and
wherein the multilayered plating layer is alloyed by the thermocompression bonding at at least a portion of the opposing surfaces of the terminal electrode and the terminal strip.

5. The method according to claim 4 ,
wherein plating layers made of a same type of metal are respectively disposed at outermost layers of the terminal electrodes and the terminal strips, and
wherein the plating layers serving as the outermost layers are metallically bonded together by the thermocompression bonding and are alloyed with inner plating layers covered by the outermost layers.

6. The method according to claim 4 ,
wherein an inner Ni plating layer and an outer Sn plating layer are each disposed over the surfaces of the terminal electrodes and the surfaces of the terminal strips, and
wherein the Sn plating layer over the surface of each terminal electrode and the Sn plating layer over the surface of the corresponding terminal strip are bonded together by the thermocompression bonding so as to form a Sn—Ni alloy.

7. The method according to claim 1 ,
wherein a surface of each terminal electrode opposing the corresponding strip of the terminal strips is convex, and
wherein the terminal strip and the terminal electrode are thermocompression bonded together at an apex of the convex surface.

8. The method according to claim 1 ,
wherein the third step is a step of applying solder cream to the outer surfaces of the terminal electrodes, and
wherein the method further comprises a step of preheating the electronic component and the solder cream between the third step and the fourth step.

9. The method according to claim 1 , wherein the fourth step is performed in a non-oxidative atmosphere.

10. A terminal-strip-equipped electronic component, comprising:
an electronic chip component including terminal electrodes on two opposing end surfaces; and
a pair of terminal strips made of a metal plate and bonded to the terminal electrodes with solder,
an outer surface of each of the terminal electrodes and an inner surface of the corresponding strip of the terminal strips being thermocompression bonded together at a center portion of the terminal electrode, and
the outer surface of the terminal electrode and the inner surface of the terminal strip being bonded together with the solder at a periphery of a center portion of the terminal electrode subjected to the thermocompression bonding.

11. The terminal-strip-equipped electronic component according to claim 10 ,
wherein a surface of each terminal electrode opposing the corresponding strip of the terminal strips is convex,
wherein the terminal strip and the terminal electrode are thermocompression bonded together at an apex of the convex surface,
wherein a pocket is formed between the terminal strip and the terminal electrode at the periphery of the center portion of the terminal electrode subjected to the thermocompression bonding, and
wherein the pocket is filled with the solder.

Assignees

• Murata Manufacturing Co

Inventors

• Kimura Nobumichi
• Houda Masuyoshi

Classifications

• B23K2101/42

  Printed circuits · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• B23K3/0638

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• B23K20/023

  Thermo-compression bonding · CPC title