Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

Patent metadata

Field	Value
Publication number	US-9425162-B2
Application number	US-201514746065-A
Country	US
Kind code	B2
Filing date	Jun 22, 2015
Priority date	Jul 2, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

First claim

What is claimed is:

1. A method of operating a thermocompression bonding machine, the method comprising the steps of:
(a) thermocompressively bonding a workpiece to a substrate at a bonding station of the thermocompression bonding machine using a placer tool;
(b) moving the placer tool to an intermediate cooling stage of the thermocompression bonding machine; and
(c) contacting the intermediate cooling stage with the placer tool to remove heat from the placer tool.

2. The method of claim 1 further comprising the step of (d) picking another workpiece from a workpiece supply using the placer tool after step (c).

3. The method of claim 2 wherein the workpiece supply comprises a semiconductor wafer.

4. The method of claim 1 wherein the workpiece comprises a semiconductor die.

5. The method of claim 1 wherein the cooling stage includes a cooling pad for receiving contact from the placer tool during step (c).

6. The method of claim 1 wherein the placer tool is included in a bond head of the thermocompression bonding machine, the bond head including (i) a heater and (ii) a chamber proximate the heater, the chamber being configured to receive a cooling fluid to reduce a temperature of the heater after step (a).

7. The method of claim 6 further including the step of providing the chamber in contact with the heater during step (a).

8. The method of claim 7 further including the step of applying a force between the chamber and the heater during step (a), and during the step of providing the chamber in contact with the heater.

9. The method of claim 7 wherein a heat exchange takes place between the heater and the chamber during the step of providing the chamber in contact with the heater.

10. The method of claim 6 further including a step of disposing at least two flexures between a support structure of the bond head and the heater.

11. The method of claim 10 wherein the at least two flexures each are anisotropically flexible.

12. The method of claim 10 wherein each of the at least two flexures are anisotropically flexible such that each of the flexures are compliant along a line that is substantially parallel to a holding surface of the placer tool, and in a direction from a center of the holding surface of the placer tool outwards toward the respective flexure.

13. The method of claim 10 wherein each of the at least two flexures are most flexible along a respective line originating in a center of the heater and extending toward the respective flexure.

14. The method of claim 6 wherein the chamber is adapted to move between a first position in contact with the heater and a second position out of contact with the heater.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Wasserman Matthew B
• Schmidt-Lange Michael P

Classifications

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07152

  Means for cooling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title