Bond pad having a trench and method for forming
US-9515034-B2 · Dec 6, 2016 · US
Wire bonding method
US9508673B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9508673-B2 |
| Application number | US-201615143227-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 29, 2016 |
| Priority date | Feb 12, 2015 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Abstract
Official abstract text for this publication.
A wire bonding method includes the following steps. First, a substrate including at least one metal finger is provided. Next, a first chip including at least one first boding pad is disposed on the substrate. Next, a metal ball bump is formed on the corresponding metal finger. Next, a first wire is formed from the metal ball bump toward the corresponding first boding pad. Next, a first free air ball is formed on the first wire by electronic flame-off process. Then, the first free air ball connected to the first wire is pressed on the corresponding first boding pad, such that the first wire is located between the first free air ball and the corresponding first boding pad.
First claim
Opening claim text (preview).
What is claimed is: 1. A wire bonding method, comprising: providing a substrate comprising at least one metal finger; disposing a first chip on the substrate and the first chip comprising at least one first boding pad; forming a metal ball bump on the corresponding metal finger; forming a first wire from the metal ball bump toward the corresponding first boding pad; forming a first free air ball on the first wire by electronic flame-off process; and pressing the first fr…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9508673B2 cover?
- A wire bonding method includes the following steps. First, a substrate including at least one metal finger is provided. Next, a first chip including at least one first boding pad is disposed on the substrate. Next, a metal ball bump is formed on the corresponding metal finger. Next, a first wire is formed from the metal ball bump toward the corresponding first boding pad. Next, a first free air…
- Who is the assignee on this patent?
- Nanya Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K20/007. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).