Solder supply device

Patent metadata

Field	Value
Publication number	US-2016338209-A1
Application number	US-201315100499-A
Country	US
Kind code	A1
Filing date	Dec 5, 2013
Priority date	Dec 5, 2013
Publication date	Nov 17, 2016
Grant date	—

Abstract

A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

First claim

1 . A solder supply device comprising:
a solder container housing liquid solder that is tubular and open at one end; a nozzle, for ejecting solder from the solder container, that is inserted into the solder container; a piston that is provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container from the opening of the solder container; and a demarcating member that demarcates an air chamber with at least one out of a surface of the other end of the solder container, an adapter attached to the surface of the other end, and a surface of the piston facing the opening of the solder container, wherein the solder supply device supplies solder from the tip of the nozzle by relatively moving the solder container and the piston by the supplying of air to the air chamber.

2 . The solder supply device according to claim 1 , wherein
the piston is provided on the outer circumferential section of the nozzle relatively movable to the nozzle, the solder supply device is further provided with a lid that seals the opening of the solder container in a state with the tip of the nozzle inserted into the solder container, and the lid functions as the demarcating member.

3 . The solder supply device according to claim 1 , wherein
the piston is fixedly provided on the outer circumferential surface of the nozzle, the solder supply device is further provided with an outer tube that is tubular with an opening at one end and that stores the solder container in a state with the other end of the solder container engaged from the opening, and the outer tube functions as the demarcating member.

4 . The solder supply device according to claim 3 , wherein
the solder supply device is further provided with an inner tube that is tubular with an opening at both ends, holds the piston or the nozzle at one end, extends from the opening of the solder container at the other end, and is fixed to the outer tube.

5 . The solder supply device according to claim 4 , wherein
the inner tube is separable from the piston or the nozzle.

6 . The solder supply device according to claim 4 , wherein
the surface of the other end of the outer tube is openable/closable.

7 . The solder supply device according to claim 6 , wherein
the outer tube is swingably attached to a solder printer that prints solder on a target object.

8 . The solder supply device according to claim 6 , wherein
the friction arising between the outer circumferential section of the piston and the inner circumferential surface of the solder container is greater than the holding force of the piston or the nozzle by the inner tube.

9 . The solder supply device according to claim 2 , wherein
the solder supply device is detachably mounted on a solder printer that prints solder on a target object by a lock mechanism.

Assignees

• Fuji Machine Mfg

Inventors

• Senga Akihiro
• Fukakusa Shoji
• Hirukawa Ritsuo
• Fujita Yoji
• Yokoi Yoshimune

Classifications

• B23K2101/42

  Printed circuits · CPC title

• B05C11/1002

  Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title

• H05K3/3468 Primary

  Application of molten solder, e.g. dip soldering · CPC title

• B05C17/00533

  comprising a piston · CPC title

• B41F15/40

  Inking units · CPC title