Vacuum transition for solder bump mold filling

Patent metadata

Field	Value
Publication number	US-9498837-B2
Application number	US-55175509-A
Country	US
Kind code	B2
Filing date	Sep 1, 2009
Priority date	Sep 1, 2009
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

First claim

What is claimed is:

1. A bond metal injection tool, comprising:
a fill head having a sealed chamber for containing a molten bond metal and a gas, and a nozzle at an outlet of the chamber for directing a flow of the molten bond metal from the chamber and then out through the nozzle into cavities in a major surface of a mold; and
a pressure control device operable to controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities when the pressure is applied within the chamber, and to controllably apply a vacuum within the chamber to prevent the bond metal from being ejected from the nozzle when the vacuum is applied within the chamber, wherein the fill head is movable from a first position in which the nozzle is juxtaposed with at least one of the cavities or a plane defined by the major surface, and a second position in which the nozzle is juxtaposed with a plane defined by a parking surface of a parking space, wherein the pressure control device is operable to apply the vacuum within the chamber separately from an operation of filling the cavities with the bond metal, to prevent the bond metal from being ejected from the nozzle when the nozzle is removed from the major surface to the parking surface when bond metal remains in the fill head immediately after filling the mold cavities in the major surface, wherein the parking space has an edge surface extending in a direction transverse to the plane defined by the parking surface, at least a portion of the edge surface of the parking space being spaced apart from an adjacent edge surface of the mold to define a gap, wherein the pressure control device is operable to apply the vacuum within the chamber to prevent the bond metal from being ejected from the nozzle when the nozzle moves from the first position away from the mold cavities across the gap to the second position; and a second nozzle to direct a flow of a second gas to the gap between the mold and the parking space.

2. The bond metal injection tool as claimed in claim 1 , wherein the fill head is configured to be sealably engaged with the mold such that a volume surrounding an opening of the nozzle is enclosed between the fill head and the mold when the fill head is sealably engaged with the mold, the fill head further including an aperture at the juxtaposed surface for applying a vacuum to at least one of the mold cavities, wherein the aperture is positioned ahead of the nozzle opening in a direction of a movement of the nozzle opening across the major surface, so as to permit evacuation of the at least one mold cavity before ejection of the bond metal into the at least one mold cavity.

3. The bond metal injection tool as claimed in claim 1 , wherein the second nozzle is adapted to direct the second gas into the gap.

4. The bond metal injection tool as claimed in claim 3 , wherein the second nozzle is adapted to eject a type of the second gas which does not oxidize the bond metal.

5. The bond metal injection tool as claimed in claim 4 , wherein the pressure control device is further operable to cause the second gas to flow whenever the nozzle is moved to a position juxtaposed with the parking space and stop the flow of the second gas whenever the nozzle is moved to a position juxtaposed with at least one of the major surface or at least one cavity therein.

6. The bond metal injection tool as claimed in claim 1 , wherein the bond metal includes tin.

7. The bond metal injection tool as claimed in claim 6 , wherein the bond metal includes at least one alloy of tin selected from the group consisting of tin-silver, tin-silver-cobalt, tin-silver-zinc, tin-silver-bismuth, tin-copper-zinc, tin-silver-copper.

8. The bond metal injection tool as claimed in claim 1 , wherein the pressure control device is operable to apply the vacuum within the chamber to prevent the bond metal from being ejected from the nozzle when the nozzle moves from the second position away from the parking space across the gap to the first position.

9. The bond metal injection tool as claimed in claim 8 , wherein the plane defined by the parking surface is raised relative to the plane defined by the major surface of the mold to define a step height difference between the adjacent edge surfaces of the parking space and the mold, and the pressure control device is operable to apply the vacuum within the chamber to prevent the bond metal from being ejected from the nozzle when the nozzle traverses the step height difference when the nozzle moves from the second position away from the parking space across the gap to the first position.

Assignees

• Garant John J
• Haas Robert G
• Leenstra Bouwe W
• Palmatier Phillip W
• IBM

Inventors

• Garant John J
• Haas Robert G
• Leenstra Bouwe W
• Palmatier Phillip W

Classifications

• B23K2101/42

  Printed circuits · CPC title

• B23K3/0623 Primary

  for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · CPC title

• B23K2201/42

  Operations & Transport · mapped topic