Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Patent metadata

Field	Value
Publication number	US-9496240-B2
Application number	US-201013321017-A
Country	US
Kind code	B2
Filing date	May 17, 2010
Priority date	May 19, 2009
Publication date	Nov 15, 2016
Grant date	Nov 15, 2016

Abstract

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

First claim

What is claimed:

1. A method of forming a wire loop in connection with a semiconductor package, the method comprising the steps of:
(1) providing package data related to the semiconductor package to a wire bonding machine;
(2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop;
(3) deriving looping parameters, using an algorithm on a computer and the package data provided in step (1), for forming the desired wire loop, wherein the deriving of the looping parameters includes using loop model data stored in the wire bonding machine in connection with the algorithm to more closely approximate the looping parameters related to the desired wire loop;
(4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3);
(5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and
(6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

2. The method of claim 1 wherein the package data provided in step (1) includes at least one of (a) CAD data related to the semiconductor package and (b) package data derived using an online teaching reference system of the wire bonding machine.

3. The method of claim 1 wherein the package data provided in step (1) includes at least one of semiconductor die height, die pad locations of a semiconductor die, lead locations of a leadframe, relative distances between first bonding locations and second bonding locations, a wire diameter, and a wire type.

4. The method of claim 1 wherein the at least one looping control value provided in step (2) includes at least one of (a) a span length of a portion of the desired wire loop, (b) a pull strength of the desired wire loop, (c) XYZ locations of a kink or bend in the desired wire loop, (d) a hump characteristic of the desired wire loop, (e) a wire sway value of the desired wire loop, (f) a wire length in the desired wire loop, (g) a wire length in at least a portion of the desired wire loop, (h) a die edge clearance value of the desired wire loop, (i) a second bond clearance value of the desired wire loop, (j) a shape of at least a portion of the desired wire loop, and (k) loop height ranges for multiple wire loops to be arranged above one another in the semiconductor package.

5. The method of claim 1 wherein the at least one looping control value provided in step (2) includes at least one of (a) a lower limit for a pull strength value of the desired wire loop, and (b) an acceptable range for a pull strength value of the desired wire loop.

6. The method of claim 1 wherein the at least one looping control value provided in step (2) includes at least one of (a) a lower limit for a wire sway value of the desired wire loop, and (b) an acceptable range for a wire sway value of the desired wire loop.

7. The method of claim 1 wherein each of the at least one looping control value provided in step (2) is provided as at least one of (a) an upper limit of the looping control value, (b) a lower limit of the looping control value, and (c) an acceptable range of the looping control value.

8. The method of claim 1 wherein the at least one looping control value provided in step (2) is provided via a graphical interface.

9. The method of claim 8 wherein the graphical interface includes a diagram of a model wire loop, whereby a user provides the at least one looping control value by varying characteristics of the diagram of the model wire loop.

10. The method of claim 1 wherein the looping parameters derived in step (3) include at least one of (a) a tool trajectory for forming the wire loop, (b) bonding energy parameters to be applied by a transducer of the wire bonding machine, (c) bonding force parameters to be applied by the wire bonding machine, (d) timing parameters related to at least one of bonding energy and bonding force, (e) bonding tool speed during at least a portion of a wire bonding cycle to form the desired wire loop, and (f) a wire clamp position during at least a portion of a wire bonding cycle to form the desired wire loop.

11. The method of claim 1 wherein the deriving of the looping parameters in step (3) includes deriving a trajectory to be followed by a bonding tool in the formation of the desired wire loop.

12. The method of claim 1 wherein step (5) includes measuring actual looping control values of the first wire loop formed in step (4) online on the wire bonding machine.

13. The method of claim 1 wherein the loop model data includes data stored in a look-up table of the wire bonding machine.

14. The method of claim 1 wherein the deriving of the looping parameters in step (3) includes selecting a wire loop type to form the desired wire loop.

15. The method of claim 1 wherein step (6) includes comparing the actual looping control values measured in step (6) to the at least one looping control value provided in step (2) to determine if the actual looping control values are within an accepted tolerance level corresponding to the at least one looping control value provided in step (2).

16. The method of claim 15 further comprising the steps of: (7) varying the looping parameters using an algorithm; and (8) forming another wire loop using the varied looping parameters.

17. The method of claim 16 wherein steps (5)-(8) are repeated for successive wire loops until the actual looping control values measured in step (6) are within an accepted tolerance level corresponding to the at least one looping control value provided in step (2).

18. The method of claim 1 wherein the at least one looping control value provided in step (2) includes at least one of a loop height range and a loop height tolerance for multiple wire loops to be arranged above one another in the semiconductor package.

19. A method of determining looping parameters for forming a wire loop in connection with a semiconductor package, the method comprising the steps of:
(1) providing package data related to the semiconductor package to a wire bonding machine;
(2) determining initial looping parameters using an algorithm on a computer for forming a wire loop from model data stored in memory;
(3) providing at least one looping control value related to a desired wire loop to the wire bonding machine before step (2), The initial looping parameters being derived at least partially based upon
(a) the package data provided in step (1),
(b) loop model data stored in the wire bonding machine in connection with the algorithm, and
(c) the at least one looping control value provided in step (3), wherein the at least one looping control value includes at least a loop height value related to the desired wire loop;
and
(4) measuring actual looping control values of a first wire loop formed after step (3) corresponding to the at least one looping control value, the step of measuring being performed online on the wire bonding machine.

20. The method of claim 19 further comprising the step of (4) prompting an operator of a wire bonding machine for additional data regarding a desired wire loop before step (2), and wherein the initial looping parameters are derived at step (2) at least partially based upon the package data provided in step (1), and the additional data provided by the operator in response to step (4).

Assignees

• Qin Ivy Wei
• Cathcart Ray L
• Huynh Cuong
• Sood Deepak
• Sucro Paul W
• Deangelo Joseph O
• Kulicke & Soffa Ind Inc

Inventors

• Qin Ivy Wei
• Cathcart Ray L
• Huynh Cuong
• Sood Deepak
• Sucro Paul W
• Deangelo Joseph O

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/07533

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title