Gas-blowing-hole array structure and soldering apparatus

Patent metadata

Field	Value
Publication number	US-9485872-B2
Application number	US-201314654956-A
Country	US
Kind code	B2
Filing date	Dec 20, 2013
Priority date	Dec 28, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P 2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P 1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P 1 is arranged to be line symmetry with the nozzle pattern P 2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.

First claim

The invention claimed is:

1. A gas-blowing-hole array structure of a gas-blowing-holes plate in a soldering apparatus for soldering a board to be soldered by discharging gas from plural gas-blowing holes arranged in the gas-blowing-holes plate while a conveyed member, which mounts the board, is conveyed, comprising:
the gas-blowing-holes plate having a predetermined nozzle layout region; and
wherein the nozzle layout region is divided into four divided sections;
wherein in an arrangement pattern of the gas-blowing holes arranged in one of the divided sections;
a first row is formed so that first and second gas-blowing holes are arranged with a predetermined width pitch along a direction that is orthogonal to a conveying direction of the conveyed member,
plural other rows are formed with a predetermined row arrangement pitch along the conveying direction with them being parallel to the first row,
the first gas-blowing hole in every other row is arranged with a predetermined space along a width direction from the first gas-blowing hole in every other row, and
the first gas-blowing holes in the first row and other rows have such a configuration that they have different phases from each other on the orthogonal direction; and
wherein in the upper and lower divided sections of opposite sides relative to a center portion of the nozzle layout region in which the width direction and the conveying direction are orthogonal to each other, a first arrangement pattern of the gas-blowing holes and a second arrangement pattern of the gas-blowing holes, which is an inverse first arrangement pattern thereof, are provided so that the arrangement patterns that are arranged on a diagonal line in the nozzle layout region are identical.

2. The gas-blowing-hole array structure according to claim 1 wherein each of the gas-blowing holes includes a crisscross opening in a forward end thereof.

3. A soldering apparatus that performs soldering by discharging gas from plural gas-blowing holes arranged in a gas-blowing-holes plate and by blowing the gas to a board to be soldered while a conveyed member, which mounts the board, is conveyed, wherein the soldering apparatus is provided with the gas-blowing-holes plate having the gas-blowing-hole array structure claimed in claim 1 .

Assignees

• Senju Metal Industry Co

Inventors

• Hiyama Tsutomu

Classifications

• B23K2101/42

  Printed circuits · CPC title

• H05K2203/081

  Blowing of gas, e.g. for cooling or for providing heat during solder reflowing · CPC title

• B23K3/04

  Heating appliances · CPC title

• H05K3/3494 Primary

  Heating processes for reflow soldering · CPC title

• H05K2203/04

  Soldering or other types of metallurgic bonding · CPC title