Pretreatment method for electroless plating, and pretreatment solution for electroless plating
US-12529145-B2 · Jan 20, 2026 · US
This page is not indexed by search engines while we improve data quality.
Yamamoto Hisamitsu patents
Yamamoto Hisamitsu is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yamamoto Hisamitsu |
| Total patents | 22 |
| First publication | Sep 7, 2017 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Copper etching solution
US-12503775-B2 · Dec 23, 2025 · US
Method of producing plating deposit
US-2024351943-A1 · Oct 24, 2024 · US
Apparatus for measuring plating deposition status
US-2024279814-A1 · Aug 22, 2024 · US
Copper etching solution
US-2022389592-A1 · Dec 8, 2022 · US
Method for producing a printed wiring board
US-11421325-B2 · Aug 23, 2022 · US
Method for producing printed wiring board
US-2021289637-A1 · Sep 16, 2021 · US
Electroless copper plating bath
US-2021262096-A1 · Aug 26, 2021 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-10927463-B2 · Feb 23, 2021 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-2021047734-A1 · Feb 18, 2021 · US
Recent patents
Latest publications not already listed above.
Method for producing a printed wiring board
US-2020378008-A1 · Dec 3, 2020 · US
Ultrasonic treatment apparatus
US-10773280-B2 · Sep 15, 2020 · US
Copper plating solution and copper plating method
US-2020002830-A1 · Jan 2, 2020 · US
Copper plating solution and copper plating method
US-10450666-B2 · Oct 22, 2019 · US
Surface treating apparatus
US-10435778-B2 · Oct 8, 2019 · US
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
US-2019264329-A1 · Aug 29, 2019 · US
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
US-10138558-B2 · Nov 27, 2018 · US
Ultrasonic treatment apparatus
US-2018133760-A1 · May 17, 2018 · US
Surface treating apparatus
US-2018087140-A1 · Mar 29, 2018 · US
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
US-2018023197-A1 · Jan 25, 2018 · US
Copper plating solution and copper plating method
US-2017268119-A1 · Sep 21, 2017 · US
Method for manufacturing wiring substrate and wiring substrate manufactured thereby
US-2017253975-A1 · Sep 7, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Uemura Kogyo Kk | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C18/38 | 10 |
| C23C18/2086 | 9 |
| H05K3/181 | 9 |
| H05K3/18 | 6 |
| C23C18/2066 | 6 |