Formaldehyde free electroless copper plating compositions and methods
US-9809883-B2 · Nov 7, 2017 · US
Electroless copper plating bath
US2021262096A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021262096-A1 |
| Application number | US-202017254741-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 13, 2020 |
| Priority date | Jul 17, 2019 |
| Publication date | Aug 26, 2021 |
| Grant date | — |
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Abstract
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An electroless copper plating bath is an electroless copper plating bath with a pH of 5 to 10 containing a hydrazine compound as a reducing agent and not containing formaldehyde. The electroless copper plating bath comprises at least: an amine-based complexing agent or an amine compound; and an aminocarboxylic acid-based complexing agent.
First claim
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1 - 6 . (canceled) 7 . An electroless copper plating bath with a pH of 5 to 10 containing a hydrazine compound as a reducing agent and not containing formaldehyde, the electroless copper plating bath comprising at least: an amine-based complexing agent or ammonia; and an aminocarboxylic acid-based complexing agent, wherein the amine-based complexing agent is at least one selected from the group consisting of a diamine compound, a triamine compound, or an aromatic amine compound. 8 . The electroless copper plating bath of claim 7 , wherein the aminocarboxylic acid-based complexing agent is at least one selected from the group consisting of ethylene diamine tetraacetic acid, nitrilotriacetic acid, diethylene triamine pentaacetic acid, hydroxyethyl ethylenediamine triacetic acid, triethylenetetramine hexaacetic acid, 1,3-propanediamine tetraacetic acid, 1,3-diamino-2-hydroxypropane tetraacetic acid, hydroxyethylimino diacetic acid, dihydroxyethyl glycine, glycol ether diamino tetraacetic acid, dicarboxymethyl glutamic acid, ethylenediamine-N,N′-disuccinic acid, or N,N,N′,N′-tetrakis-(2-hydroxypropyl)ethylenediamine. 9 . The electroless copper plating bath of claim 7 , further comprising a carboxylic acid-based complexing agent. 10 . The electroless copper plating bath of claim 9 , wherein the carboxylic acid-based complexing agent is at least one selected from the group consisting of monocarboxylic acid, dicarboxylic acid, or oxycarboxylic acid.
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- What does patent US2021262096A1 cover?
- An electroless copper plating bath is an electroless copper plating bath with a pH of 5 to 10 containing a hydrazine compound as a reducing agent and not containing formaldehyde. The electroless copper plating bath comprises at least: an amine-based complexing agent or an amine compound; and an aminocarboxylic acid-based complexing agent.
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification H05K3/187. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).