Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board

Patent metadata

Field	Value
Publication number	US-10927463-B2
Application number	US-201716318253-A
Country	US
Kind code	B2
Filing date	Jun 19, 2017
Priority date	Aug 10, 2016
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y= an integer of 1 to 3).

First claim

The invention claimed is:

1. A pretreating liquid for electroless plating to be used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced, the pretreating liquid comprising:
a reducing agent;
a fluorine compound;
water; and
at least one selected from the group consisting of
ethylene-based glycol ether represented by CmH(2m+1)-(OC 2 H 4 )n-OH, wherein m=an integer of 1 to 4 and n=an integer of 1 to 4, and
propylene-based glycol ether represented by CxH(2x+1)-(OC 3 H 6 )y-OH, wherein x=an integer of 1 to 4 and y=an integer of 1 to 3,

wherein the pretreating liquid has a water content of 78 mass % or lower, and
wherein the pretreating liquid has a pH of 3.0 or less.

2. The pretreating liquid for electroless plating according to claim 1 , wherein the insulating resin substrate contains a silica-based filler, and the content of SiO 2 in the insulating resin substrate is 30% by mass or more.

Assignees

• Uemura Kogyo Kk

Inventors

• Saijo Yoshikazu
• Yamamoto Hisamitsu
• Naka Nobuhiko

Classifications

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K3/381

  by special treatment of the substrate · CPC title

• H05K3/181

  by electroless plating (adhesives therefor H05K3/387) · CPC title

• C23C18/2086 Primary

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/16

  by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence) · CPC title