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Copper plating solution and copper plating method
US2020002830A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020002830-A1 |
| Application number | US-201916567669-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 11, 2019 |
| Priority date | Mar 18, 2016 |
| Publication date | Jan 2, 2020 |
| Grant date | — |
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Abstract
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A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
First claim
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What is claimed is: 1 . A copper plating solution comprising: water-soluble copper salt; ethylenediamine; at least one of ethylenediaminetetraacetic acid (EDTA), a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; at least one of hydantoin or a substituted derivative thereof, and at least one of hypophosphite or organic salt, and wherein: the copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper, and wherein the at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine has a molar ratio of 0.4 or more and 0.7 or less with respect to the ethylenediamine. 2 . The copper plating solution of claim 1 , wherein the copper plating solution is free from nickel salt. 3 . A copper plating method comprising: a pretreatment process of pretreating a surface of an aluminum or aluminum alloy base; and a copper plating process of displacement-plating the aluminum or aluminum alloy base with copper using the copper plating solution of claim 1 after the pretreatment process, wherein the copper plating process is performed on the aluminum or aluminum alloy base which is untreated with zincate. 4 . The copper plating method of claim 3 , wherein the pretreatment process includes degreasing, alkali etching, and acid washing.
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Frequently asked questions
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- What does patent US2020002830A1 cover?
- A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification C23C18/54. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Jan 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).