Copper etching solution

Patent metadata

Field	Value
Publication number	US-12503775-B2
Application number	US-202217727003-A
Country	US
Kind code	B2
Filing date	Apr 22, 2022
Priority date	Jun 1, 2021
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.

First claim

What is claimed is:

1 . A circuit board processing method comprising etching a copper portion on a circuit board in connection to a dissimilar metal by using a copper etching solution, wherein the copper etching solution comprises:
one or more oxidizing agents selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, and a perborate; and an amine compound having one or more primary amino groups or secondary amino groups,
the dissimilar metal is stainless steel, silver, and/or gold, and
the dissimilar metal is in contact with a surface portion of the circuit board conducted to the copper portion and is in contact with the copper etching solution,
wherein an etching rate of the copper is from 0.0208 μm/min to less than 0.2 um/min, the etching rate is represented by a formula of etching amount (μm)/immersion time (min).

2 . The circuit board processing method of claim 1 , wherein the amine compound is one or more compounds selected from methylamine, ethylamine, ethylenediamine, triethylenetetramine, tetraethylenepentamine, diethylenetriamine, monoethanolamine, aniline, benzylamine, phenethylamine, anisidine, glycine, alanine, arginine, asparagine, glutamine, histidine, lysine, phenylalanine, and serine.

3 . The circuit board processing method of claim 1 , wherein the amine compound is one or more compounds selected from dimethylamine, diethylamine, diethanolamine, methylaniline, and proline.

4 . The circuit board processing method of claim 1 , wherein the copper etching solution has a pH of 6 or more.

5 . The circuit board processing method of claim 1 , wherein a variation of an etching amount compared to an etching amount when the copper portion is not in connection to the dissimilar metal is 10% or less.

6 . The circuit board processing method of claim 1 , wherein
the circuit board is held by a jig and is immersed in the copper etching solution, and the dissimilar metal is a part of the jig.

7 . The circuit board processing method of claim 6 , wherein the dissimilar metal includes stainless steel.

8 . The circuit board processing method of claim 1 , wherein
the circuit board has a via hole and/or through hole, and the copper inner layer of the via hole and/or through hole is etched.

9 . The circuit board processing method of claim 1 , wherein
the dissimilar metal is contact with an end portion of the circuit board.

10 . The circuit board processing method of claim 4 , wherein
the circuit board has an exposed nickel portion on the surface of the circuit board, and a corrosion of the exposed nickel portion is suppressed.

Assignees

• Uemura Kogyo Kk

Inventors

• Komeda Takuya
• Ishida Tetsuji
• Yamamoto Hisamitsu
• Kato Kazunari
• SHIMIZU Ryoyu

Classifications

• C23F1/18 Primary

  for etching copper or alloys thereof · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title

• C23F1/34 Primary

  for etching copper or alloys thereof · CPC title