Pretreatment method for electroless plating, and pretreatment solution for electroless plating

Patent metadata

Field	Value
Publication number	US-12529145-B2
Application number	US-202017631837-A
Country	US
Kind code	B2
Filing date	Jun 3, 2020
Priority date	Aug 2, 2019
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

The purpose of the present invention is to provide a pretreatment method for electroless plating and a pretreatment solution for electroless plating capable of increasing an adsorption amount of a catalyst. A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises: a cleaner process S 10 ; a soft etching process S 20 and/or an acid treatment process S 30 ; a catalyst imparting process S 40 ; and a catalyst reducing process S 50 , wherein an anionic surfactant for ionizing a part of a hydrophilic group to an anion is added to a treatment solution used in the soft etching process S 20 and/or the acid treatment process S 30 , an ionic catalyst is imparted on the substrate in the catalyst imparting process S 40 , and the ionic catalyst is reduced in the catalyst reducing process S 50 to increase an adsorption amount of the catalyst on the substrate.

First claim

The invention claimed is:

1 . A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises a cleaner process; a soft etching process; an acid treatment process; a catalyst imparting process; and a catalyst reducing process,
wherein the cleaner process comprises cleaning the substrate with a cleaner solution having a first surfactant, wherein the soft etching process comprises etching the substrate, dissolving a metal disposed on at least a portion of the substrate, and removing the first surfactant with a first treatment solution that includes a first acid, wherein the acid treatment process comprises washing the substrate with a second treatment solution that includes a second acid, wherein the catalyst imparting process comprises imparting an ionic catalyst on the substrate, wherein the catalyst reducing process comprises reducing complex ions adsorbed on the substrate to metal, and wherein an anionic surfactant for ionizing a part of a hydrophilic group to an anion is added to the first treatment solution and the second treatment solution, and the ionic catalyst is reduced in the catalyst reducing process to increase an adsorption amount of the catalyst on the substrate.

2 . The pretreatment method for electroless plating according to claim 1 , wherein the pretreatment method enables adsorption of a metal catalyst on the substrate without requiring a predip process to facilitate the adsorption.

3 . The pretreatment method for electroless plating according to claim 1 , wherein a concentration of the anionic surfactant is 0.01 to 10 g/L.

4 . The pretreatment method for electroless plating according to claim 1 , wherein the anionic surfactant is one or more of a carboxylate, a sulfonate, a polyoxyethylene alkyl ether phosphate, and a polyacrylate.

5 . The pretreatment method for electroless plating according to claim 1 , wherein the anionic surfactant is an alkyl diphenyl ether disulfonate.

6 . The pretreatment method for electroless plating according to claim 1 , wherein the catalyst is a palladium.

Assignees

• Uemura Kogyo Kk

Inventors

• Ishida Tetsuji
• Yamamoto Hisamitsu
• SHIMIZU Ryoyu

Classifications

• C23C18/2086 Primary

  with use of organic or inorganic compounds other than metals, first · CPC title

• B01J23/44

  Palladium · CPC title

• C23C18/26

  using organic liquids · CPC title

• C23C18/24 Primary

  using acid aqueous solutions · CPC title

• C23C18/1889

  with use of metal first · CPC title