Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

Patent metadata

Field	Value
Publication number	US-10138558-B2
Application number	US-201615549471-A
Country	US
Kind code	B2
Filing date	Jan 25, 2016
Priority date	Feb 12, 2015
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

First claim

The invention claimed is:

1. A pretreatment agent for electroless plating, comprising:
a silane coupling agent;
a surfactant; and
ethylene-based glycol butyl ethers of formula: C 4 H 9 —(OC 2 H 4 ) n OH where n is an integer of 1 to 4, and/or propylene-based glycol butyl ethers of formula: C 4 H 9 —(OC 3 H 6 ) n OH where n is an integer of 1 to 4.

2. The pretreatment agent for electroless plating according to claim 1 , having a pH of 8.5 or higher.

3. A pretreatment agent for electroless plating, comprising:
a silane coupling agent;
a surfactant; and
ethylene-based glycol butyl ethers of formula: C 4 H 9 —(OC 2 H 4 ) n —OH where n is an integer of 1 to 4.

4. The pretreatment agent for electroless plating according to claim 3 , having a pH of 8.5 or higher.

5. A method for pretreating a substrate to be used for a printed wiring board, comprising:
treating the surface of a substrate to be used for a printed wiring board with a pretreatment agent according to claim 1 .

6. A process for producing a printed wiring board, comprising:
treating the surface of a substrate to be used for a printed wiring board with a pretreatment agent for electroless plating according to claim 1 ; and
then performing electroless plating.

Assignees

• Uemura Kogyo Kk

Inventors

• Saijo Yoshikazu
• Yamamoto Hisamitsu
• Ishida Tetsuji
• Komeda Takuya
• Utsumi Masayuki

Classifications

• C23C18/38

  Coating with copper · CPC title

• H05K3/181

  by electroless plating (adhesives therefor H05K3/387) · CPC title

• C23C18/22

  Roughening, e.g. by etching · CPC title

• H05K2203/0776

  Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 · CPC title

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title