A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Copper etching solution
US2022389592A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022389592-A1 |
| Application number | US-202217727003-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 22, 2022 |
| Priority date | Jun 1, 2021 |
| Publication date | Dec 8, 2022 |
| Grant date | — |
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Abstract
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A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
First claim
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What is claimed is: 1 . A copper etching solution comprising: one or more oxidizing agents selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate; and an amine compound having one or more primary amino groups or secondary amino groups. 2 . The copper etching solution of claim 1 , wherein the amine compound is one or more compounds selected from methylamine, ethylamine, ethylenediamine, triethylenetetramine, tetraethylenepentamine, diethylenetriamine, monoethanolamine, aniline, benzylamine, phenethylamine, anisidine, glycine, alanine, arginine, asparagine, glutamine, histidine, lysine, phenylalanine, and serine. 3 . The copper etching solution of claim 1 , wherein the amine compound is one or more compounds selected from dimethylamine, diethylamine, diethanolamine, methylaniline, and proline. 4 . The copper etching solution of claim 1 , having a pH of 6 or more. 5 . A circuit board processing method comprising etching a copper portion on a circuit board in connection to a dissimilar metal by using the copper etching solution of claim 1 .
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- What does patent US2022389592A1 cover?
- A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
- Who is the assignee on this patent?
- Uemura Kogyo Kk
- What technology area does this patent fall under?
- Primary CPC classification C23F1/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Dec 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).