Copper plating solution and copper plating method

Patent metadata

Field	Value
Publication number	US-10450666-B2
Application number	US-201715464175-A
Country	US
Kind code	B2
Filing date	Mar 20, 2017
Priority date	Mar 18, 2016
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

First claim

What is claimed is:

1. A copper plating solution comprising:
water-soluble copper salt;
ethylenediamine;
ethylenediaminetetraacetic acid tetrasodium salt tetrahydrate (EDTA4Na);
at least one of hydantoin or a substituted derivative thereof, and
at least one of hypophosphite or organic salt, and wherein:
the copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper, and
wherein the EDTA4Na has a molar ratio of 0.4 or more and 0.7 or less with respect to the ethylenediamine.

2. The copper plating solution of claim 1 , wherein the copper plating solution is free from nickel salt.

3. A copper plating method comprising:
a pretreatment process of pretreating a surface of an aluminum or aluminum alloy base; and
a copper plating process of displacement-plating the aluminum or aluminum alloy base with copper using the copper plating solution of claim 1 after the pretreatment process, wherein
the copper plating process is performed on the aluminum or aluminum alloy base which is untreated with zincate.

4. The copper plating method of claim 3 , wherein
the pretreatment process includes degreasing, alkali etching, and acid washing.

Assignees

• Uemura Kogyo Kk

Inventors

• Yoshioka Yuko
• Nakayama Tomoharu
• Yamamoto Hisamitsu

Classifications

• C23C18/54 Primary

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C25D5/44

  Aluminium · CPC title

• C23C18/40 Primary

  using reducing agents · CPC title

• C25D3/38 Primary

  of copper · CPC title

• C25D5/022

  using masking means · CPC title