Substrate processing apparatus and method of manufacturing semiconductor device
US-2026068590-A1 · Mar 5, 2026 · US
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Taniyama Tomoshi patents
Taniyama Tomoshi is listed as an inventor on 87 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Taniyama Tomoshi |
| Total patents | 87 |
| First publication | Jul 21, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-12518981-B2 · Jan 6, 2026 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-12489010-B2 · Dec 2, 2025 · US
Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing method
US-12456636-B2 · Oct 28, 2025 · US
Substrate processing apparatus
US-2025271156-A1 · Aug 28, 2025 · US
Substrate processing apparatus
US-2025270700-A1 · Aug 28, 2025 · US
Substrate processing apparatus, furnace opening assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory tangible medium
US-12398460-B2 · Aug 26, 2025 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-2025201585-A1 · Jun 19, 2025 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-12123091-B2 · Oct 22, 2024 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-12116666-B2 · Oct 15, 2024 · US
Recent patents
Latest publications not already listed above.
Substrate processing apparatus and method of manufacturing semiconductor device
US-2024339337-A1 · Oct 10, 2024 · US
Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatus
US-12065736-B2 · Aug 20, 2024 · US
Substrate processing device, manufacturing method for semiconductor device, and reaction tube
US-12062546-B2 · Aug 13, 2024 · US
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-2024224238-A1 · Jul 4, 2024 · US
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-11935762-B2 · Mar 19, 2024 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-11913116-B2 · Feb 27, 2024 · US
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory tangible medium
US-2023357920-A1 · Nov 9, 2023 · US
Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatus
US-11788188-B2 · Oct 17, 2023 · US
Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatus
US-2023313371-A1 · Oct 5, 2023 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-2023017917-A1 · Jan 19, 2023 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-2023016879-A1 · Jan 19, 2023 · US
Substrate processing apparatus and method of manufacturing semiconductor device, and recording medium
US-2022392783-A1 · Dec 8, 2022 · US
Substrate processing apparatus
US-11512392-B2 · Nov 29, 2022 · US
Substrate processing apparatus
US-11495477-B2 · Nov 8, 2022 · US
Control valve, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US-2022325801-A1 · Oct 13, 2022 · US
Cooling method, a method of manufacturing a semiconductor device and a non-transitory computer-readable recording medium
US-2022310420-A1 · Sep 29, 2022 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-11456190-B2 · Sep 27, 2022 · US
Substrate processing apparatus, furnace opening assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory tangible medium
US-2022298627-A1 · Sep 22, 2022 · US
Substrate processing apparatus and method of manufacturing semiconductor device
US-11450536-B2 · Sep 20, 2022 · US
Substrate processing apparatus
US-11396700-B2 · Jul 26, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kokusai Electric Corp | 64 |
| Hitachi Int Electric Inc | 29 |
| Tokyo Electron Ltd | 2 |
| Hitachit Kokusai Electric Inc | 1 |
| Hitachi Koku Sai Electric Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0402 | 54 |
| H10P72/0434 | 47 |
| C23C16/4412 | 44 |
| H10P72/0431 | 38 |
| H01L21/67109 | 28 |