Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0434 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 5,936 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 300 |
| 2016 | 313 |
| 2017 | 334 |
| 2018 | 429 |
| 2019 | 530 |
| 2020 | 624 |
| 2021 | 599 |
| 2022 | 661 |
| 2023 | 674 |
| 2024 | 630 |
| 2025 | 703 |
| 2026 | 139 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
Method for manufacturing silicon wafer and silicon wafer
US-2024304458-A1 · Sep 12, 2024 · US
Electrostatic chuck
US-2024297063-A1 · Sep 5, 2024 · US
Substrate processing method and substrate processing system
US-2024173742-A1 · May 30, 2024 · US
Substrate supporting device, a substrate processing apparatus including the same, and a substrate processing method using the same
US-2024162017-A1 · May 16, 2024 · US
Ceramic susceptor
US-11963270-B2 · Apr 16, 2024 · US
Bonding method and bonding apparatus
US-11931995-B2 · Mar 19, 2024 · US
Substrate treatment method, and computer storage medium
US-2024036473-A1 · Feb 1, 2024 · US
Substrate treating apparatus and substrate treating method
US-2024030057-A1 · Jan 25, 2024 · US
Cassette housing, prober, server rack, and storage system
US-2024014061-A1 · Jan 11, 2024 · US
Method of manufacturing semiconductor device and substrate processing apparatus
US-2015371843-A1 · Dec 24, 2015 · US
Lithographic Apparatus and Method
US-2015370180-A1 · Dec 24, 2015 · US
Multi zone heating and cooling esc for plasma process chamber
US-2015366004-A1 · Dec 17, 2015 · US
Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium
US-2015364318-A1 · Dec 17, 2015 · US
Chuck exhaust openings
US-9214373-B2 · Dec 15, 2015 · US
Vacuum processing apparatus
US-2015357214-A1 · Dec 10, 2015 · US
Dense composite material, method for manufacturing the same, joined body, and member for semiconductor manufacturing apparatuses
US-9184070-B2 · Nov 10, 2015 · US
Dry non-plasma treatment system
US-2015314313-A1 · Nov 5, 2015 · US
Degassing apparatus adapted to process substrates in multiple tiers with second actuator
US-9177842-B2 · Nov 3, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0434?
- CPC H10P72/0434 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P72/0434 (Electricity)?
- Our database includes 5,936 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0434 growing?
- Publication counts under this code: 630 in 2024 vs 703 in 2025 (latest complete years).