Substrate handling system, method, and apparatus
US-12553133-B2 · Feb 17, 2026 · US
This page is not indexed by search engines while we improve data quality.
Suarez Edwin C patents
Suarez Edwin C is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Suarez Edwin C |
| Total patents | 35 |
| First publication | Apr 14, 2016 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor processing chamber for improved precursor flow
US-12340979-B2 · Jun 24, 2025 · US
Deposition ring of a process kit for semiconductor substrate processing
US-D1069863-S · Apr 8, 2025 · US
Grounding ring of a process kit for semiconductor substrate processing
US-D1064005-S · Feb 25, 2025 · US
Deposition ring of a process kit for semiconductor substrate processing
US-D1059312-S · Jan 28, 2025 · US
Deposition ring for thin substrate handling via edge clamping
US-12100579-B2 · Sep 24, 2024 · US
Cover ring for use in semiconductor processing chamber
US-D1038049-S · Aug 6, 2024 · US
Process chamber having shutter cover for substrate uniformity and prevention of unintended deposition
US-2024240322-A1 · Jul 18, 2024 · US
Thin substrate handling via edge clamping
US-11996315-B2 · May 28, 2024 · US
Substrate Handling System, Method, and Apparatus
US-2024044002-A1 · Feb 8, 2024 · US
Recent patents
Latest publications not already listed above.
Retaining ring design
US-2022339755-A1 · Oct 27, 2022 · US
Retaining ring design
US-11400560-B2 · Aug 2, 2022 · US
Deposition ring for thin substrate handling via edge clamping
US-2022157572-A1 · May 19, 2022 · US
Thin substrate handling via edge clamping
US-2022157635-A1 · May 19, 2022 · US
Systems and methods for internal surface conditioning assessment in plasma processing equipment
US-10796922-B2 · Oct 6, 2020 · US
Systems and methods for internal surface conditioning in plasma processing equipment
US-10707061-B2 · Jul 7, 2020 · US
Polishing system with local area rate control and oscillation mode
US-10610994-B2 · Apr 7, 2020 · US
Textured small pad for chemical mechanical polishing
US-10589399-B2 · Mar 17, 2020 · US
Systems and methods for internal surface conditioning in plasma processing equipment
US-10593523-B2 · Mar 17, 2020 · US
Systems and methods for internal surface conditioning assessment in plasma processing equipment
US-2020058516-A1 · Feb 20, 2020 · US
Systems and methods for internal surface conditioning assessment in plasma processing equipment
US-10490418-B2 · Nov 26, 2019 · US
Local area polishing system and polishing pad assemblies for a polishing system
US-10434623-B2 · Oct 8, 2019 · US
Retaining ring design
US-2019099857-A1 · Apr 4, 2019 · US
Semiconductor processing chamber for improved precursor flow
US-2018337024-A1 · Nov 22, 2018 · US
Systems and methods for internal surface conditioning assessment in plasma processing equipment
US-2018240654-A1 · Aug 23, 2018 · US
Systems and methods for internal surface conditioning assessment in plasma processing equipment
US-9966240-B2 · May 8, 2018 · US
Anti-arc zero field plate
US-2018119281-A1 · May 3, 2018 · US
Anti-arc zero field plate
US-9850576-B2 · Dec 26, 2017 · US
Local area polishing system and polishing pad assemblies for a polishing system
US-2017274497-A1 · Sep 28, 2017 · US
Polishing system with local area rate control and oscillation mode
US-2017274495-A1 · Sep 28, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 35 |
| Baek Jonghoon | 1 |
| Suarez Edwin C | 1 |
| Tanaka Tsutomu | 1 |
| Hammond Iv Edward P | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0421 | 14 |
| H01J37/32082 | 14 |
| C23C16/52 | 13 |
| H10P74/238 | 12 |
| H10P50/283 | 12 |