Semiconductor processing chamber for improved precursor flow

Patent metadata

Field	Value
Publication number	US-12340979-B2
Application number	US-201815981089-A
Country	US
Kind code	B2
Filing date	May 16, 2018
Priority date	May 17, 2017
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define an opening to a central channel at the first end, and the central channel may be characterized by a first cross-sectional surface area. The adapter may define an exit from a second channel at the second end, and the adapter may define a transition between the central channel and the second channel within the adapter between the first end and the second end. The adapter may define a third channel between the transition and the second end of the adapter, and the third channel may be fluidly isolated from the central channel and the second channel.

First claim

The invention claimed is:

1. A semiconductor processing system comprising:
a processing chamber;
a remote plasma unit coupled with the processing chamber; and
an adapter coupled with the remote plasma unit, wherein the adapter comprises a body characterized by a first end and a second end opposite the first end, wherein the body defines an opening to a central channel at the first end, wherein the central channel is characterized by a first diameter, wherein the body defines an exit from a plurality of second channels at the second end, wherein the body defines a transition plate that extends between and fluidly couples the central channel and the plurality of second channels within the body between the first end and the second end of the body, wherein the transition plate defines a plurality of orifices and a solid interior region, wherein the plurality of second channels extend from the transition plate to the second end of the body and are characterized by each channel of the plurality of second channels comprising a radius that matches a radius of a respective orifice the plurality of orifices of the transition plate, wherein the body defines a third channel between the transition plate and the second end of the body, wherein the plurality of second channels extend circumferentially about the third channel, wherein the third channel is axially aligned with the central channel, wherein the third channel is fluidly isolated from the central channel and the plurality of second channels within the body, wherein the body defines a port providing access to the third channel, and wherein the central channel extends through the body to a depth at which the port is located.

2. The semiconductor processing system of claim 1 , wherein the central channel is characterized by a first cross-sectional surface area and the plurality of second channels are characterized by a second cross-sectional area less than the first cross-sectional area.

3. The semiconductor processing system of claim 1 , wherein the plurality of second channels form a pattern extending circumferentially about the third channel.

4. The semiconductor processing system of claim 1 , wherein the remote plasma unit is seated on the first end of the body of the adapter.

5. The semiconductor processing system of claim 1 , wherein the adapter is a single component.

6. The semiconductor processing system of claim 1 , wherein the transition plate tapers from a largest diameter proximate the central channel to a smallest diameter proximate the second channel.

7. The semiconductor processing system of claim 1 , further comprising an isolator coupled between the adapter and the processing chamber, wherein the isolator comprises an annular member about an isolator channel, and wherein the isolator channel is fluidly coupled with the second channel and the third channel.

8. The semiconductor processing system of claim 7 , further comprising a mixing manifold coupled between the isolator and the processing chamber.

9. The semiconductor processing system of claim 8 , wherein the mixing manifold is characterized by an inlet having a diameter equal to a diameter of the isolator channel.

10. The semiconductor processing system of claim 9 , wherein the inlet of the mixing manifold transitions to a tapered section of the mixing manifold.

11. The semiconductor processing system of claim 10 , wherein the tapered section of the mixing manifold transitions to a flared section of the mixing manifold extending to an outlet of the mixing manifold.

12. The semiconductor processing system of claim 11 , further comprising:
a gasbox coupled with the isolator opposite the adapter, the gasbox being characterized by a first surface facing the isolator and a second surface opposite the first surface; and
a faceplate that is coupled with the second surface of the gasbox.

13. A semiconductor processing system comprising:
a remote plasma unit;
a processing chamber comprising:
a gasbox defining a central channel,
a blocker plate coupled with the gasbox, wherein the blocker plate defines a plurality of apertures through the blocker plate,
a faceplate coupled with the gasbox at a first surface of the faceplate, and
an ion suppression element coupled with the faceplate at a second surface of the faceplate opposite the first surface of the faceplate; and

an adapter coupled with the remote plasma unit, wherein the adapter comprises a body characterized by first end and a second end opposite the first end, wherein the body defines an opening to a central channel at the first end, wherein the central channel is characterized by a first diameter, wherein the body defines an exit from a plurality of second channels at the second end, wherein the body defines a transition plate that extends between and fluidly couples the central channel and the plurality of second channels within the body between the first end and the second end of the body, wherein the transition plate defines a plurality of orifices and a solid interior region, wherein the plurality of second channels extend from the transition plate to the second end of the body and are characterized by each channel of the plurality of second channels comprising a radius that matches a radius of a respective orifice the plurality of orifices of the transition plate, wherein the body defines a third channel between the transition plate and the second end of the body, wherein the plurality of second channels extend circumferentially about the third channel, and wherein the third channel is fluidly isolated from the central channel and the plurality of second channels within the body, wherein the body further defines a port providing access to the third channel, and wherein the central channel extends through the body to a depth at which the port is located.

14. The semiconductor processing system of claim 13 , further comprising a heater coupled externally to the gasbox about a mixing manifold coupled to the gasbox.

15. The semiconductor processing system of claim 13 , wherein the gasbox defines a volume from above and the blocker plate defines the volume from below and about an outer radius.

16. The semiconductor processing system of claim 13 , wherein the gasbox, faceplate, and ion suppression element are directly coupled together.

17. The semiconductor processing system of claim 13 , wherein the faceplate is characterized along a vertical cross-section of the faceplate by a first diameter and a second diameter, wherein the faceplate defines a ledge on an interior of the first surface of the faceplate extending to an internal region of the faceplate characterized by the second diameter.

18. The semiconductor processing system of claim 17 , wherein the blocker plate extends into the internal region of the faceplate, and wherein the blocker plate is characterized by a diameter within five percent of the second diameter.

19. The semiconductor processing system of claim 17 , wherein the first surface of the faceplate and the second surface of the faceplate are characterized by the first diameter.

20. The semiconductor processing system of claim 19 , wherein the gasbox defines a plurality of annular trenches along a surface of the gasbox in contact with the faceplate, and wherein the ion suppression element defines a plurality of annular trenches along a surface of the ion suppression element in contact with the faceplate.

Assignees

• Applied Materials Inc

Inventors

• Tan Tien Fak
• Lubomirsky Dmitry
• Jung Soonwook
• Park Soonam
• Lu Raymond W
• Pham Phong
• Suarez Edwin C

Classifications

• H10P72/0421 Primary

  for drying etching · CPC title

• H01J37/32522

  Temperature · CPC title

• C23C16/45565

  Shower nozzles · CPC title

• H01J37/32889

  Connection or combination with other apparatus · CPC title

• C23C16/45536

  Use of plasma, radiation or electromagnetic fields · CPC title