Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
US-2024234132-A1 · Jul 11, 2024 · US
US9850576B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9850576-B2 |
| Application number | US-98284310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 30, 2010 |
| Priority date | Feb 15, 2010 |
| Publication date | Dec 26, 2017 |
| Grant date | Dec 26, 2017 |
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Embodiments of the present invention generally relate to apparatus for reducing arcing and parasitic plasma in substrate processing chambers. The apparatus generally include a processing chamber having a substrate support, a backing plate, and a showerhead disposed therein. A showerhead suspension electrically couples the backing plate to the showerhead. An electrically conductive bracket is coupled to the backing plate and spaced apart from the showerhead. The electrically conductive bracket may include a plate, a lower portion, an upper portion, and a vertical extension. The electrically conductive bracket contacts an electrical isolator.
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We claim: 1. A vacuum processing chamber, comprising: a backing plate disposed in a chamber body; a showerhead disposed in the chamber body and coupled to the backing plate; one or more showerhead suspensions electrically coupling the backing plate to the showerhead; an electrically conductive bracket coupled to the backing plate and spaced apart from the showerhead suspension, the electrically conductive bracket comprising a plate positioned substantially perpendicular to a face of the showerhead; and an electrical isolator having a first side contacting the plate of the electrically conductive bracket and a second side contacting the chamber body, the electrical isolator positioned radially outward of the electrically conductive bracket. 2. The processing chamber of claim 1 , wherein the processing chamber is a PECVD chamber, and the PECVD chamber further comprises an RF source coupled to the backing plate. 3. The processing chamber of claim 1 , wherein the electrical isolator comprises ceramic, alumina, or polytetrafluoroethylene. 4. The processing chamber of claim 1 , wherein the electrically conductive bracket further comprises: a lower portion coupled to a bottom edge of the plate, the lower portion substantially perpendicular to the plate; and a vertical extension coupled to the lower portion, the vertical extension parallel to the plate, wherein the vertical extension has a length less than a length of the plate. 5. The processing chamber of claim 4 , wherein the vertical extension includes cut-outs therein to accommodate a tool. 6. The processing chamber of claim 4 , wherein the electrically conductive bracket further comprises an upper portion coupled to the plate and positioned substantially parallel to the lower portion. 7. The processing chamber of claim 4 , wherein there is substantially no space between the electrically conductive bracket and the electrical isolator. 8. The processing chamber of claim 1 , wherein the electrically conductive bracket comprises aluminum. 9. The processing chamber of claim 1 , wherein the electrically conductive bracket is flexible. 10. The vacuum processing chamber of claim 1 , wherein the electrically conductive bracket is positioned radially outward of the showerhead suspension. 11. A processing chamber, comprising: a chamber body; a lid disposed on the chamber body; a showerhead disposed in the chamber body; an electrically conductive bracket electrically coupled to the showerhead, the electrically conductive bracket disposed laterally outward of the showerhead and in a spaced apart relation to the showerhead; and an electrical insulator disposed against a radially-outward surface of the electrically conductive bracket, the electrical insulator positioned radially outward of the electrically conductive bracket, the electrical insulator in contact with the chamber body. 12. The processing chamber of claim 11 , further comprising a flexible suspension coupling the showerhead to the lid.
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