Local area polishing system and polishing pad assemblies for a polishing system

Patent metadata

Field	Value
Publication number	US-10434623-B2
Application number	US-201715456320-A
Country	US
Kind code	B2
Filing date	Mar 10, 2017
Priority date	Mar 25, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

First claim

The invention claimed is:

1. A polishing module, comprising:
a chuck having a substrate receiving surface and a perimeter; and
a polishing pad assembly positioned about the perimeter of the chuck, wherein the polishing pad assembly is coupled to an actuator that provides movement of the polishing pad assembly in one or more of a sweep direction, a radial direction, and an oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck, and the polishing pad assembly comprises:
a polishing head that is configured to support a polishing pad; and
a pad actuator assembly that is configured to cause at least a portion of the polishing pad to translate relative to the polishing head, wherein the polishing head includes a housing having an interior wall, and a rotor of the actuator assembly intermittently contacts the interior wall of the housing.

2. The module of claim 1 , wherein the polishing head is circular.

3. The module of claim 2 , wherein the polishing pad assembly is circular.

4. The module of claim 2 , wherein the polishing pad assembly is polygonal.

5. The module of claim 2 , wherein the polishing pad assembly comprises a plurality of pad assembly posts.

6. The module of claim 1 , wherein the polishing head is arc-shaped.

7. The module of claim 6 , wherein the polishing pad assembly is circular.

8. The module of claim 6 , wherein the polishing pad assembly is polygonal.

9. The module of claim 6 , wherein the polishing pad assembly comprises a plurality of pad assembly posts.

10. A polishing module, comprising:
a chuck having a substrate receiving surface and a perimeter;
a polishing head disposed about the perimeter; and
a polishing pad assembly disposed in a housing that is coupled to the polishing head, wherein the polishing head is coupled to an actuator configured to provide movement of the polishing pad assembly in a sweep direction and a radial direction that is less than about one-half of a radius of the chuck, and the polishing head includes a pad actuator assembly that includes a pad actuator that has a rotating shaft and a rotor that intermittently contacts the housing to provide oscillating movement between the polishing pad assembly and the housing.

11. The module of claim 10 , wherein the polishing head is circular.

12. The module of claim 11 , wherein the polishing pad assembly is circular.

13. The module of claim 11 , wherein the polishing pad assembly is polygonal.

14. The module of claim 11 , wherein the polishing pad assembly comprises a plurality of pad assembly posts.

15. The module of claim 10 , wherein the polishing head is arc-shaped.

16. The module of claim 15 , wherein the polishing pad assembly is circular.

17. The module of claim 15 , wherein the polishing pad assembly is polygonal.

18. The module of claim 15 , wherein the polishing pad assembly comprises a plurality of pad assembly posts.

19. A polishing module, comprising:
a chuck having a substrate receiving surface and a perimeter; and
a polishing head positioned about the perimeter of the chuck, the polishing head being coupled to a housing having a polishing pad assembly disposed thereon, wherein:
the polishing head is coupled to an actuator that provides movement of the polishing pad assembly in a sweep direction and a radial direction that is less than about one-half of a radius of the chuck, and the polishing head includes a motor that is coupled to a shaft and a rotor that intermittently contacts the housing to provide oscillating movement between the polishing pad assembly and the housing;
the polishing head is circular; and
the polishing pad assembly is circular or polygonal.

Assignees

• Applied Materials Inc

Inventors

• Lau Eric
• Chen Hui
• Heung King Yi
• Lee Wei-Cheng
• Chou Chih Chung
• Suarez Edwin C
• Sin Garrett Ho Yee
• Garretson Charles C
• Oh Jeonghoon

Classifications

• B24B37/30

  for single side lapping of plane surfaces · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title