Polishing system with local area rate control and oscillation mode

Patent metadata

Field	Value
Publication number	US-10610994-B2
Application number	US-201715456413-A
Country	US
Kind code	B2
Filing date	Mar 10, 2017
Priority date	Mar 25, 2016
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

First claim

The invention claimed is:

1. A polishing module, comprising:
a base;
a chuck coupled to the base and having a substrate receiving surface and a perimeter, the substrate receiving surface having a center;
one or more polishing pad assemblies positioned about the perimeter of the chuck and overlying the chuck,
wherein each polishing pad assembly of the one or more polishing pad assemblies are coupled to an actuator assembly that provides a first movement of a respective one polishing pad assembly of the one or more polishing pad assemblies in a first arcuate direction having a first center of rotation at the center of the substrate receiving surface and wherein the actuator assembly further provides a second movement of the respective one polishing pad assembly of the one or more polishing pad assemblies in a second arcuate direction having a second center of rotation that does not coincide with the first center of rotation;
a support arm coupled to a corresponding one polishing pad assembly of the one or more polishing pad assemblies; and
a linear movement mechanism coupled between the support arm and the base, wherein the linear movement mechanism is configured to provide a third movement of the support arm and the corresponding one polishing pad assembly in a radial direction relative to the center of the substrate receiving surface and the base, and
wherein at least one of the first movement, the second movement, and the third movement are utilized to polish only a local area on a substrate disposed on the substrate receiving surface.

2. The module of claim 1 , wherein each of the one or more polishing pad assemblies are coupled to a polishing head.

3. The module of claim 2 , wherein the actuator assembly includes a motor positioned therein that is coupled to a shaft and a rotor.

4. The module of claim 3 , wherein the shaft is eccentrically shaped.

5. The module of claim 3 , wherein the rotor is eccentrically shaped.

6. The module of claim 2 , wherein the polishing head comprises a housing coupled to a support member.

7. The module of claim 6 , wherein the housing is coupled to the support member by two or more flexible posts that maintain the support member and the housing in a substantially parallel relationship.

8. The module of claim 6 , wherein the housing includes a housing base having a volume formed therein.

9. The module of claim 8 , wherein the volume is operable to provide a fluid flow path through the housing and to the respective one of the one or more polishing pad assemblies.

10. A polishing module, comprising:
a base;
a chuck coupled to the base and having a substrate receiving surface and a perimeter, the substrate receiving surface having a center;
a plurality of polishing heads disposed in radial positions about the perimeter;
a polishing pad assembly overlying the chuck and disposed in a housing that is coupled to a polishing head of plurality of polishing heads, wherein the polishing pad assembly is coupled to an actuator assembly that provides a first movement of the polishing pad assembly in a first arcuate direction having a first center of rotation at the center of the substrate receiving surface and the base and wherein the actuator assembly further provides a second movement of the polishing pad assembly in a second arcuate direction having a second center of rotation that does not coincide with the first center of rotation, and the actuator assembly provides the first movement between the polishing pad assembly and the housing;
a support arm coupled to the polishing pad assembly; and
a linear movement mechanism coupled between the support arm and the base, wherein the linear movement mechanism is configured to provide a third movement of the support arm and the polishing pad assembly in a radial direction relative to the center of the substrate receiving surface and the base,
wherein at least one of the first movement, the second movement, and the third movement is utilized to polish only a local area on a surface of a substrate disposed on the substrate receiving surface, and wherein the local area consists of a surface area of a single die formed on the surface of the substrate.

11. The module of claim 10 , wherein the actuator assembly includes a motor that is coupled to a shaft and a rotor.

12. The module of claim 11 , wherein the shaft is eccentrically shaped.

13. The module of claim 11 , wherein the rotor is eccentrically shaped.

14. The module of claim 10 , wherein two or more flexible posts are coupled between a support member and the housing that maintain the support member and the housing in a substantially parallel relationship.

15. The module of claim 10 , wherein the housing includes a housing base having a volume formed therein.

16. The module of claim 15 , wherein the volume provides a fluid flow path through the housing and to the polishing pad assembly.

17. A polishing module, comprising:
a base;
a chuck coupled to the base and having a substrate receiving surface and a perimeter, the substrate receiving surface having a center;
a plurality of polishing heads positioned about the perimeter of the chuck, each of the plurality of polishing heads coupled to a respective housing having a polishing pad assembly disposed thereon, wherein each of the plurality of polishing heads are coupled to an actuator assembly overlying the chuck and that provides a first movement of the polishing pad assembly in a first arcuate direction having a first center of rotation at the center of the substrate receiving surface and the base and wherein the actuator assembly further provides a second movement of the polishing pad assembly in a second arcuate direction having a second center of rotation that does not coincide with the first center of rotation, and the actuator assembly includes a motor that is coupled to a shaft and a rotor that provides the first movement between the polishing pad assembly and the respective housing;
a support arm coupled to the polishing pad assembly; and
a linear movement mechanism coupled between the support arm and the base, wherein the linear movement mechanism is configured to provide a third movement of the support arm and the polishing pad assembly in a radial direction relative to the center of the substrate receiving surface and the base, and
wherein at least one of the first movement, the second movement, and the third movement is utilized to polish only a local area on a surface of a substrate disposed on the substrate receiving surface.

18. The module of claim 17 , wherein the shaft is eccentrically shaped.

19. The module of claim 17 , wherein the rotor is eccentrically shaped.

20. The module of claim 17 , wherein each of the plurality of polishing heads are coupled to a common actuator.

Assignees

• Applied Materials Inc

Inventors

• Lau Eric
• Chen Hui
• Heung King Yi
• Chou Chih Chung
• Suarez Edwin C
• Sin Garrett Ho Yee
• Garretson Charles C
• Oh Jeonghoon

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/10 Primary

  for single side lapping · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title