Retaining ring design

US11400560B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11400560-B2
Application numberUS-201816149939-A
CountryUS
Kind codeB2
Filing dateOct 2, 2018
Priority dateOct 4, 2017
Publication dateAug 2, 2022
Grant dateAug 2, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A retaining ring, comprising: an annular body comprising: an upper surface; a lower surface; an outer surface connected to the upper surface and the lower surface; and an inner surface connected to the upper surface and the lower surface, wherein the inner surface comprises: a first planar surface having a first angle relative to a central axis; a second planar surface having a second angle relative to a central axis; and a third planar surface disposed between the first planar surface and the second planar surface, wherein the first planar surface forms an inward taper from the first end to the second end towards a central axis and the second planar surface forms a taper outward from the first end to the second end away from the central axis. 2. The retaining ring of claim 1 , wherein the second angle is between 1 degree and 30 degrees. 3. The retaining ring of claim 1 , further comprising: one or more channels disposed within the annular body, wherein the channels have a first opening at the inner surface and a second opening at the outer surface. 4. The retaining ring of claim 1 , wherein the inner surface is symmetric about a central axis. 5. The retaining ring of claim 1 , wherein the second surface comprises an array of planar facets that are positioned about the central axis. 6. The retaining ring of claim 5 , wherein the array of planar facets comprises 12 to 100 planar facets. 7. The retaining ring of claim 1 , wherein the first angle is between 5 degrees and 85 degrees. 8. A retaining ring, comprising: an annular body comprising: an upper surface; a lower surface; an outer surface connected to the upper surface and the lower surface; and an inner surface connected to the upper surface and the lower surface, wherein the inner surface comprises: a first planar surface having a first angle relative to a central axis; a second planar surface having a second angle relative to a central axis; and a third planar surface disposed between the first planar surface and the second planar surface, wherein the first planar surface and the second planar surface each form an inward taper from the first end to the second end towards a central axis. 9. The retaining ring of claim 8 , wherein the second angle is between 1 degree and 30 degrees. 10. The retaining ring of claim 8 , further comprising: one or more channels disposed within the annular body, wherein the channels have a first opening at the inner surface and a second opening at the outer surface. 11. The retaining ring of claim 8 , wherein the inner surface is symmetric about a central axis. 12. The retaining ring of claim 8 , wherein the second surface comprises an array of planar facets that are positioned about the central axis. 13. The retaining ring of claim 12 , wherein the array of planar facets comprises 12 to 100 planar facets. 14. The retaining ring of claim 8 , wherein the first angle is between 5 degrees and 85 degrees. 15. A retaining ring, comprising: an annular body comprising: an upper surface; a lower surface; an outer surface connected to the upper surface and the lower surface; and an inner surface connected to the upper surface and the lower surface, wherein the inner surface comprises: a first planar surface having a first angle relative to a central axis; a second planar surface having a second angle relative to a central axis; and a third planar surface disposed between the first planar surface and the second planar surface, wherein the third planar surface is substantially parallel to the central axis. 16. The retaining ring of claim 15 , wherein the second angle is between 1 degree and 30 degrees. 17. The retaining ring of claim 15 , further comprising: one or more channels disposed within the annular body, wherein the channels have a first opening at the inner surface and a second opening at the outer surface. 18. The retaining ring of claim 15 , wherein the inner surface is symmetric about a central axis. 19. The retaining ring of claim 15 , wherein the second surface comprises an array of planar facets that are positioned about the central axis. 20. The retaining ring of claim 19 , wherein the array of planar facets comprises 12 to 100 planar facets.

Assignees

Inventors

Classifications

  • using mechanical means, e.g. clamps or pinches · CPC title

  • B24B37/32Primary

    Retaining rings · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US11400560B2 cover?
Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/32. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 02 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).