Etching method for substrate to be processed and plasma-etching device
US-2015118858-A1 · Apr 30, 2015 · US
US9966240B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9966240-B2 |
| Application number | US-201414514222-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 14, 2014 |
| Priority date | Oct 14, 2014 |
| Publication date | May 8, 2018 |
| Grant date | May 8, 2018 |
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In an embodiment, a plasma source includes a first electrode, configured for transfer of one or more plasma source gases through first perforations therein; an insulator, disposed in contact with the first electrode about a periphery of the first electrode; and a second electrode, disposed with a periphery of the second electrode against the insulator such that the first and second electrodes and the insulator define a plasma generation cavity. The second electrode is configured for movement of plasma products from the plasma generation cavity therethrough toward a process chamber. A power supply provides electrical power across the first and second electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products. One of the first electrode, the second electrode and the insulator includes a port that provides an optical signal from the plasma.
Opening claim text (preview).
We claim: 1. A plasma source, comprising: a first perforated electrode comprising a first planar surface that is configured for transfer of one or more plasma source gases through first perforations therein; a second perforated electrode comprising a second planar surface that is configured for movement of plasma products therethrough toward a process chamber, the second electrode being held at electrical ground; an insulator having upper and lower surfaces that are disposed in contact with the first and second planar surfaces about a periphery of the first perforated electrode and a periphery of the second perforated electrode, such that the first and second perforated electrodes and the insulator define a plasma generation cavity; and a power supply that provides electrical power across the first and second perforated electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products; wherein the insulator includes a port that provides an optical signal from the plasma, the port comprising: a radial aperture formed within the insulator; an optical window that is sealable to the insulator across an outer opening of the radial aperture, and a fixture that positions a fiber optic adjacent the optical window such that optical emissions from the plasma propagate into the fiber optic to form the optical signal, the fiber being oriented such that the optical signal is limited to optical emissions originating within the plasma generation cavity. 2. The plasma source of claim 1 , wherein the optical signal is not influenced by interactions of the plasma products after they move through the second perforated electrode toward the process chamber. 3. The plasma source of claim 1 , wherein the insulator is a ceramic ring. 4. The plasma source of claim 1 , wherein the optical window comprises sapphire or quartz. 5. The plasma source of claim 1 , further comprising an optical emission spectrometer that receives the optical signal and generates emission peak data from the optical signal. 6. The plasma source of claim 5 , further comprising a computer configured for generating records of the emission peak data. 7. The plasma source of claim 6 , the emission peak data including hydrogen emission peak data, the computer being configured to calculate a stability metric of the hydrogen emission peak data over sequential process sequences of the plasma source. 8. The plasma source of claim 1 , wherein at least one of the first and second perforated electrodes comprises yttria. 9. The plasma source of claim 1 , the one or more source gases comprising a fluorine source. 10. The plasma source of claim 9 , the fluorine source comprising NF 3 . 11. The plasma source of claim 1 , wherein the first planar surface of the first perforated electrode extends along a single plane from a perforated center region of the first perforated electrode, to the periphery where the first planar surface is disposed in contact with the upper surface of the insulator. 12. The plasma source of claim 1 , wherein the second planar surface of the second perforated electrode extends along a single plane from a perforated center region of the second perforated electrode, to the periphery where the second planar surface is disposed in contact with the lower surface of the insulator.
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