Polishing pad having arc-shaped configuration
US-2019047110-A1 · Feb 14, 2019 · US
Textured small pad for chemical mechanical polishing
US10589399B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10589399-B2 |
| Application number | US-201715461944-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2017 |
| Priority date | Mar 24, 2016 |
| Publication date | Mar 17, 2020 |
| Grant date | Mar 17, 2020 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.
First claim
Opening claim text (preview).
What is claimed is: 1. A polishing pad assembly, comprising: a circular membrane; and a polishing pad portion having a perimeter that forms a convex circular shape and having a polishing surface to contact a substrate during a polishing operation, wherein the polishing pad portion has a width at least five times smaller than a width of the membrane, wherein the polishing pad portion is positioned at about a center of the circular membrane, wherein an upper surface of the polishing pad portion includes one or more recesses and one or more plateaus having a top surface that provides the polishing surface, wherein the one or more recesses comprise a first plurality of parallel grooves and a second plurality of parallel grooves perpendicular to the first plurality of parallel grooves, and wherein the polishing surface has a plurality of edges defined by intersections between side walls of the one or more recesses and the top surface of the one or more plateaus. 2. The assembly of claim 1 , wherein the first plurality of parallel grooves is exactly two to six grooves, and the second plurality of parallel grooves is the same number of grooves. 3. The assembly of claim 1 , wherein the membrane and the polishing pad portion are a unitary body. 4. The assembly of claim 1 , wherein the polishing pad portion is secured to the membrane by an adhesive. 5. The assembly of claim 1 , wherein the membrane comprises a first portion surrounded by a less flexible second portion, and the polishing pad portion is joined to the first portion.
Assignees
Inventors
Classifications
for single side lapping · CPC title
- B24B37/26Primary
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
designed for working plane surfaces · CPC title
of semiconductor materials · CPC title
Accessories · CPC title
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Frequently asked questions
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- What does patent US10589399B2 cover?
- A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a…
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification B24B37/26. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 17 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).