Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via
US-12100644-B2 · Sep 24, 2024 · US
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Siegert Joerg patents
Siegert Joerg is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Siegert Joerg |
| Total patents | 29 |
| First publication | May 14, 2015 |
| Latest publication | Sep 24, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layer
US-11572271-B2 · Feb 7, 2023 · US
Pressure sensor device and method for forming a pressure sensor device
US-11313749-B2 · Apr 26, 2022 · US
Method for manufacturing an optical sensor and optical sensor
US-11271134-B2 · Mar 8, 2022 · US
Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via
US-2022059434-A1 · Feb 24, 2022 · US
Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation
US-11107848-B2 · Aug 31, 2021 · US
Method for manufacturing an etch stop layer and mems sensor comprising an etch stop layer
US-2021214216-A1 · Jul 15, 2021 · US
Method for manufacturing an optical sensor and optical sensor
US-2020313031-A1 · Oct 1, 2020 · US
Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
US-10684412-B2 · Jun 16, 2020 · US
Optoelectronic device with a refractive element and a method of producing such an optoelectronic device
US-10644047-B2 · May 5, 2020 · US
Recent patents
Latest publications not already listed above.
Pressure sensor device and method for forming a pressure sensor device
US-2019265119-A1 · Aug 29, 2019 · US
Semiconductor device for wafer-scale integration
US-10332931-B2 · Jun 25, 2019 · US
Semiconductor device comprising an aperture array and method of producing such a semiconductor device
US-10283541-B2 · May 7, 2019 · US
An optoelectronic device with a refractive element and a method of producing such an optoelectronic device
US-2019035835-A1 · Jan 31, 2019 · US
Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
US-2019025505-A1 · Jan 24, 2019 · US
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
US-9991177-B2 · Jun 5, 2018 · US
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
US-2018090393-A1 · Mar 29, 2018 · US
Method of producing a removable wafer connection and carrier for wafer support
US-9929035-B2 · Mar 27, 2018 · US
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
US-9852955-B2 · Dec 26, 2017 · US
Semiconductor device comprising an aperture array and method of producing such a semiconductor device
US-2017309665-A1 · Oct 26, 2017 · US
Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror
US-9753218-B2 · Sep 5, 2017 · US
Semiconductor device for wafer-scale integration
US-2017179183-A1 · Jun 22, 2017 · US
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
US-2017133281-A1 · May 11, 2017 · US
Method of wafer-scale integration of semiconductor devices and semiconductor device
US-9608035-B2 · Mar 28, 2017 · US
Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror
US-2016334572-A1 · Nov 17, 2016 · US
Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation
US-2016020238-A1 · Jan 21, 2016 · US
Method of producing a removable wafer connection and carrier for wafer support
US-2015348817-A1 · Dec 3, 2015 · US
Method of application of a carrier to a device wafer
US-2015340264-A1 · Nov 26, 2015 · US
Method of wafer-scale integration of semiconductor devices and semiconductor device
US-2015129999-A1 · May 14, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ams Ag | 27 |
| Sciosense Bv | 1 |
| Ams Int Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0234 | 8 |
| H10W20/20 | 8 |
| H10F39/811 | 8 |
| H10W20/023 | 7 |
| H01L27/14636 | 7 |