Curable resin composition, production method of image sensor chip using the same, and image sensor chip
US-2015287756-A1 · Oct 8, 2015 · US
US10644047B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10644047-B2 |
| Application number | US-201616069802-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2016 |
| Priority date | Jan 13, 2016 |
| Publication date | May 5, 2020 |
| Grant date | May 5, 2020 |
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A top surface of a substrate is provided with a detection element for detecting electromagnetic radiation. A refractive element is formed by a portion of a cover element, which is attached to the substrate, so that the refractive element is arranged facing the detection element. The refractive element may be arranged within a recess of the cover element, so that a cavity is formed between the detection element and the refraction element.
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The invention claimed is: 1. An optoelectronic device, comprising: a substrate having a top surface; a cover element attached to the substrate above the top surface, the cover element having a rear surface facing the top surface of the substrate; a detection element, which is provided for detecting electromagnetic radiation, arranged at the top surface of the substrate; a further element, which is provided for directing electromagnetic radiation, arranged above the detection element; a dielectric layer arranged between the substrate and the cover element, the detection element being arranged in the dielectric layer; a metal layer arranged in the dielectric layer; a through-substrate interconnection arranged in the substrate, the through-substrate interconnection contacting the metal layer; and the further element being a refractive element, which is formed by a portion of the cover element at the rear surface. 2. The optoelectronic device according to claim 1 , further comprising: a recess at the rear surface of the cover element, the recess forming a cavity between the detection element and the refractive element. 3. The optoelectronic device according to claim 1 , further comprising: an intermediate layer arranged between the substrate and the cover element, the intermediate layer comprising an opening between the detection element and the refractive element. 4. The optoelectronic device according to claim 1 , further comprising: a recess at the rear surface of the cover element; and an intermediate layer, which is different from the dielectric layer, being arranged between the substrate and the cover element, the intermediate layer comprising an opening between the detection element and the refractive element, the recess and the opening forming a cavity between the detection element and the refractive element. 5. The optoelectronic device according to claim 1 , further comprising: a recess at the rear surface of the cover element, the recess forming a cavity between the detection element and the refractive element; an intermediate layer, which is different from the dielectric layer, being arranged between the substrate and the cover element; and an opening of the intermediate layer, the opening forming a further cavity between the detection element and the refractive element, the further cavity being separated from the cavity by the intermediate layer. 6. The optoelectronic device according to claim 5 , further comprising: a further refractive element formed in the intermediate layer within the further recess. 7. The optoelectronic device according to claim 1 , further comprising: an integrated circuit in the substrate. 8. The optoelectronic device according to one of claim 2 , wherein the refractive element extends over the entire rear surface of the cover element within the recess. 9. The optoelectronic device according to one of claim 2 , further comprising: a getter layer applied to the rear surface of the cover element within the recess. 10. The optoelectronic device according to claim 1 , further comprising: a front surface of the cover element, the front surface being opposite the rear surface; and the front surface being structured in the area of the refractive element. 11. A method of producing an optoelectronic device, comprising: providing a substrate with a dielectric layer and arranging detection elements and a metal layer in the dielectric layer, the detection elements being provided for detecting electromagnetic radiation; forming a through-substrate interconnection in the substrate, the through-substrate interconnection contacting the metal layer; providing a further substrate with surface structures forming refractive elements; and attaching the further substrate to the substrate, the surface structures facing the detection elements, and the dielectric layer being arranged between the substrate and the further substrate. 12. The method according to claim 11 , wherein the surface structures of the further substrate are formed within recesses. 13. The method according to claim 11 , further comprising: forming the through-substrate interconnection, including a via hole and a metallization, before the further substrate is bonded to the substrate. 14. The method according to claim 11 , further comprising: forming the through-substrate interconnection, including a via hole and a metallization, after the further substrate is bonded to the substrate. 15. The method according to claim 11 , further comprising: forming the surface structures of the further substrate by applying a reflow layer on the further substrate, structuring the reflow layer to form separate portions having curved surfaces, and transferring the curved surfaces to the further substrate. 16. An optoelectronic device, comprising: a substrate having a top surface; a cover element attached to the substrate above the top surface, the cover element having a rear surface facing the top surface of the substrate; a detection element arranged at the top surface of the substrate, the detection element being provided for detecting electromagnetic radiation; a dielectric layer arranged between the substrate and the cover element, the detection element being arranged in the dielectric layer; a refractive element formed by a portion of the cover element at the rear surface above the detection element, the refractive element being provided for directing electromagnetic radiation; a metal layer arranged in the dielectric layer; a through-substrate interconnection arranged in the substrate, the through-substrate interconnection contacting the metal layer; a recess at the rear surface of the cover element, the recess forming a cavity between the detection element and the refractive element; an intermediate layer arranged between the substrate and the cover element, the intermediate layer being different from the dielectric layer; and an opening of the intermediate layer, the opening forming a further cavity between the detection element and the refractive element, the further cavity being separated from the cavity by the intermediate layer. 17. The optoelectronic device according to claim 16 , further comprising: a further refractive element formed in the intermediate layer within the further recess.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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