Power package
US-D1121577-S · Apr 7, 2026 · US
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Saxena Kuldeep patents
Saxena Kuldeep is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Saxena Kuldeep |
| Total patents | 20 |
| First publication | May 5, 2016 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-2025149432-A1 · May 8, 2025 · US
Multifunctional Adhesion Promoter for Semiconductor Device Packages
US-2025122413-A1 · Apr 17, 2025 · US
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-12224233-B2 · Feb 11, 2025 · US
Power semiconductor package with improved performance
US-12199045-B2 · Jan 14, 2025 · US
Power Semiconductor Package
US-2024304507-A1 · Sep 12, 2024 · US
Thermal Enhanced Power Semiconductor Package
US-2024243031-A1 · Jul 18, 2024 · US
Top side cooled semiconductor packages
US-2023420329-A1 · Dec 28, 2023 · US
Power semiconductor package
US-D969762-S · Nov 15, 2022 · US
Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers
US-2022238426-A1 · Jul 28, 2022 · US
Recent patents
Latest publications not already listed above.
Power semiconductor package
US-D937231-S · Nov 30, 2021 · US
Power semiconductor package with improved performance
US-2021305166-A1 · Sep 30, 2021 · US
Corrugated package for microelectromechanical system (MEMS) device
US-10442683-B2 · Oct 15, 2019 · US
Microphone package with molded spacer
US-9894444-B2 · Feb 13, 2018 · US
Microphone package with molded spacer
US-2017303049-A1 · Oct 19, 2017 · US
Corrugated Package for Microelectromechanical System (MEMS) Device
US-2017297905-A1 · Oct 19, 2017 · US
Molded interconnect mircoelectromechanical system (MEMS) device package
US-9781519-B2 · Oct 3, 2017 · US
Microphone package with molded spacer
US-9661421-B2 · May 23, 2017 · US
Molded Interconnect Mircoelectromechanical System (MEMS) Device Package
US-2016234604-A1 · Aug 11, 2016 · US
Microphone package with molded spacer
US-2016127838-A1 · May 5, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Wolfspeed Inc | 10 |
| Bosch Gmbh Robert | 8 |
| Akustica Inc | 4 |
| Cree Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0257 | 8 |
| H10W70/481 | 7 |
| H10W90/756 | 6 |
| B81B7/0061 | 6 |
| H10W90/753 | 6 |