Microphone package with molded spacer

Patent metadata

Field	Value
Publication number	US-9661421-B2
Application number	US-201514924789-A
Country	US
Kind code	B2
Filing date	Oct 28, 2015
Priority date	Oct 29, 2014
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.

First claim

What is claimed is:

1. A microelectromechanical system (MEMS) microphone package comprising:
a MEMS microphone die configured to sense acoustic pressure and to generate an electrical signal based on the sensed acoustic pressure;
an application specific integrated circuit (ASIC) electrically connected to the MEMS microphone die, the ASIC configured to receive the electrical signal from the MEMS microphone die;
a substrate including electrical connection pads;
a conductive lid including an acoustic input port; and
a package spacer having a top surface and a bottom surface, the top surface connected to the conductive lid and the bottom surface secured to the substrate, the package spacer formed of a molded material.

2. The MEMS microphone package of claim 1 , further comprising a bonding shelf formed with the package spacer as a monolithic component and positioned in an interior of the package spacer, the bonding shelf including a wire bonding surface.

3. The MEMS microphone package of claim 2 , wherein a plurality of wires are electrically connected between the wire bonding surface and the ASIC.

4. The MEMS microphone package of claim 2 , further comprising a plurality of electrical traces that extend from the bottom surface of the package spacer to the wire bonding surface, at least one of the electrical traces electrically connected to the substrate via at least one of the electrical connection pads.

5. The MEMS microphone package of claim 4 , wherein the electrical traces are deposited on the bonding shelf.

6. The MEMS microphone package of claim 4 , further comprising a seal ring positioned along a perimeter of the bottom surface of the package spacer, wherein at least another one of the electrical traces is electrically connected to the seal ring.

7. The MEMS microphone package of claim 1 , wherein the package spacer includes a top surface that is coated with a conductive material.

8. The MEMS microphone package of claim 2 , wherein the bonding shelf includes a bottom surface that is flush with the bottom surface of the package spacer such that the bottom surface of the bonding shelf contacts the substrate.

9. The MEMS microphone package of claim 2 , wherein the bonding shelf includes a top surface that is flush with the top surface of the package spacer such that the top surface of the bonding shelf contacts the conductive lid.

10. The MEMS microphone package of claim 1 , wherein the package spacer is positioned between the substrate and the conductive lid, the spacer maintaining a spacing between the substrate and the conductive lid and forming side walls of the MEMS microphone package.

11. The MEMS microphone package of claim 1 , wherein the molded material is ceramic.

12. The MEMS microphone package of claim 1 , wherein the molded material is plastic.

13. The MEMS microphone package of claim 1 , wherein the package spacer includes at least one conductive via electrically connecting the substrate and the conductive lid.

14. The MEMS microphone package of claim 13 , wherein the at least one conductive via is formed on an exterior surface of the package spacer.

15. The MEMS microphone package of claim 14 , wherein the at least one conductive via is a ground path for the MEMS microphone die and the ASIC.

16. The MEMS microphone package of claim 1 , further comprising a wire that electrically connects the ASIC to the conductive lid.

17. The MEMS microphone package of claim 1 , wherein the ASIC and the MEMS microphone die are affixed to the conductive lid.

18. The MEMS microphone package of claim 1 , wherein the conductive lid is a stamped, substantially planer metal lid.

19. The MEMS microphone package of claim 1 , wherein the package spacer provides external electrical connections to the MEMS microphone package including an electrical connection for a signal line and an electrical connection for a ground line.

20. A microelectromechanical system (MEMS) microphone package comprising:
a first die configured to sense acoustic pressure and to generate an electrical signal based on the sensed acoustic pressure;
a second die electrically connected to the first die, the second die configured to receive the electrical signal from the first die; and
a package spacer having a cavity and a bonding shelf, the bonding shelf formed with the package spacer as a monolithic component and positioned within an interior of the package spacer, wherein the first die and the second die are disposed within the cavity, and
wherein the second die is electrically connected to the bonding shelf.

21. The MEMS microphone package of claim 20 , further comprising a substrate.

22. The MEMS microphone package of claim 21 , wherein the bonding shelf includes a surface contacted with at least a portion of the substrate.

23. The MEMS microphone package of claim 22 , further comprising a conductive lid connected to the package spacer.

24. The MEMS microphone package of claim 23 , wherein at least one from the group consisting of the first die and the second die is attached to the conductive lid.

25. The MEMS microphone package of claim 23 , wherein the package spacer includes a first surface and a second surface, wherein the first surface is positioned above the surface of the bonding shelf and connected to the substrate and wherein the second surface is opposed to the first surface and is connected to the conductive lid.

26. The MEMS microphone package of claim 25 , wherein at least one from the group consisting of the first die and the second die is attached to the conductive lid.

Assignees

• Bosch Gmbh Robert

Inventors

• Salmon Jay Scott
• Saxena Kuldeep

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R1/06 Primary

  Arranging circuit leads; Relieving strain on circuit leads · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• H04R2231/001

  Moulding aspects of diaphragm or surround · CPC title