Molded Interconnect Mircoelectromechanical System (MEMS) Device Package

Patent metadata

Field	Value
Publication number	US-2016234604-A1
Application number	US-201615099096-A
Country	US
Kind code	A1
Filing date	Apr 14, 2016
Priority date	Oct 29, 2014
Publication date	Aug 11, 2016
Grant date	—

Abstract

A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

First claim

What is claimed is:

1 . A microelectromechanical system (MEMS) device package comprising:
a spacer having a top surface, a bottom surface, and a cavity formed between the top and bottom surfaces; a bonding shelf assembly having a bonding shelf positioned in the cavity; a substrate connected to the bottom surface of the spacer; and a lid connected to the top surface of the spacer; wherein the bonding shelf is molded with at least one of the substrate or the lid to form a single monolithic component of the MEMS device package.

2 . The MEMS device package of claim 1 further comprising at least one MEMS device mounted on at least one of the substrate or the lid, the MEMS device is electrically connected to the bonding shelf.

3 . The MEMS device package of claim 1 wherein the bonding shelf extends perpendicular to one of the substrate or the lid.

4 . The MEMS device package of claim 2 wherein the bonding shelf divides the cavity into a first and second cavities.

5 . The MEMS device package of claim 4 , wherein at least one MEMS device is disposed within the first cavity and a second MEMS device is disposed within the second cavity.

6 . The MEMS device package of claim 5 , further comprising a port formed on at least one of the substrate or the lid, the port is fluidly communicated with one of the first or second cavity.

7 . The MEMS device package of claim 6 , wherein the MEMS device disposed in the first cavity, the port is fluidly communicated with the MEMS device via the first cavity.

8 . The MEMS device package of claim 7 , further comprising a second MEMS device package coupled to at one of the substrate or the lid.

9 . The MEMS device package of claim 8 , wherein the second MEMS device package is located either above, below, or adjacent to the port.

10 . A microelectromechanical system (MEMS) device package comprising:
a substrate; a lid; an outer spacer having a top surface, a bottom surface, and a cavity formed between the top and bottom surfaces; and an inner spacer having a bonding shelf assembly positioned in the cavity; wherein the bonding shelf assembly is molded with the inner spacer to form a single monolithic component of the MEMS device package.

11 . The MEMS device package of claim 10 wherein at least one MEMS device is disposed within the cavity, the MEMS device is electrically connected to one of the substrate or the lid via the bonding shelf assembly.

12 . A combo microelectromechanical system (MEMS) device package assembly comprising:
a first MEMS device package having a cover; a second MEMS device package having a cover; a common substrate having a first surface and a second surface; and a bonding shelf assembly having a conductive surface; wherein the cover of the first MEMS device package is electrically coupled to the first surface of the common substrate and the cover of the second MEMS device package is electrically coupled to the second surface of the common substrate, the bonding shelf assembly is formed as a portion of at least one of the cover of the first or second MEMS device package.

13 . The combo MEMS device package assembly of claim 12 wherein a port is formed on the first MEMS device package.

14 . The combo MEMS device package assembly of claim 13 wherein the second MEMS device package is located either above, below, or adjacent to the port of the first MEMS device package.

15 . The combo MEMS device package assembly of claim 14 wherein a port is formed on the second MEMS device package.

16 . The combo MEMS device package assembly of claim 15 wherein the port of the first MEMS device package fluidly communicated with an environment via the port formed on the second MEMS device package.

17 . The combo MEMS device package assembly of claim 15 wherein the port of the first MEMS device package fluidly communicated with an environment.

Assignees

• Akustica Inc
• Bosch Gmbh Robert

Inventors

• Saxena Kuldeep

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• B81B2207/097

  Interconnects arranged on the substrate or the lid, and covered by the package seal · CPC title

• H04R1/06

  Arranging circuit leads; Relieving strain on circuit leads · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title