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Power semiconductor package

USD969762S · US · S1

Patent metadata
FieldValue
Publication numberUS-D969762-S
Application numberUS-202129811014-F
CountryUS
Kind codeS1
Filing dateOct 11, 2021
Priority dateApr 6, 2020
Publication dateNov 15, 2022
Grant dateNov 15, 2022

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CLAIM The ornamental design for a power semiconductor package, as shown and described.

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