Multifunctional Adhesion Promoter for Semiconductor Device Packages

Patent metadata

Field	Value
Publication number	US-2025122413-A1
Application number	US-202318487665-A
Country	US
Kind code	A1
Filing date	Oct 16, 2023
Priority date	Oct 16, 2023
Publication date	Apr 17, 2025
Grant date	—

Abstract

Semiconductor device packages are provided. In one example, a semiconductor device package comprises a first structure having a first surface in the semiconductor device package, a second structure having a second surface in the semiconductor device package, and an adhesion promoting layer in contact with the first surface on a first side and the second surface on a second side. The adhesion promoting layer comprises a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine containing a functional group.

First claim

1 . A semiconductor device package, comprising:
a first structure having a first surface in the semiconductor device package; a second structure having a second surface in the semiconductor device package; and an adhesion promoting layer in contact with the first surface on a first side and the second surface on a second side, wherein the adhesion promoting layer comprises a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine containing a functional group.

2 . The semiconductor device package of claim 1 , wherein the tetracarboxylic dianhydride is represented by the following formula (TD11) or (TD12):

wherein R TD11 , R TD12 , R TD13 , and R TD14 each independently represent a hydrogen atom, a carboxyl group, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted phenyl group.

3 . The semiconductor device package of claim 2 , wherein the tetracarboxylic dianhydride comprises pyromellitic dianhydride, methylpyromellitic dianhydride, dimethylpyromellitic dianhydride, ethylpyromellitic dianhydride, diethylpyromellitic dianhydride, phenylpyromellitic dianhydride, diphenylpyromellitic dianhydride, 1,2,3,4,5-benzenepentacarboxylic 1,2,4,5-dianhydride, 1,2,3,4,5-benzenepentacarboxylic 1,2,3,4-dianhydride, benzenehexacarboxylic 1,2,4,5-dianhydride, and benzenehexacarboxylic 1,2,3,4-dianhydride, or a combination thereof.

4 . The semiconductor device package of claim 1 , wherein the tetracarboxylic dianhydride is represented by the following formula (TD21) or (TD22):

wherein R TD21 and R TD22 each independently represent a hydrogen atom, a carboxyl group, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted phenyl group;
n21 and n22 each independently represent 0, or an integer of 1 to 3;
W 21 represents a single bond, or any one group of the following 1) to 8):
1) —C(═O)—, —C(═O)—O—, —C(═O)NH—, or —O—;
2) an alkylene group (for example, an alkylene group having 1 to 12 carbon atoms);
3) a fluoroalkylene group (for example, an alkylene group having 1 to 12 carbon atoms, having at least one hydrogen atom substituted with a fluorine atom);
4) —Si(—R TD23 )(—R TD24 )— (in which R TD23 and R TD24 each independently represent an alkyl group (for example, an alkyl group having 1 to 3 carbon atoms), an aryl group (for example, a phenyl group and a naphthyl group), or an alkoxy group);
5) —O—Ph—R TD25 —Ph—O— (in which Ph represents a phenylene group, and R TD25 represents —S—S—, —S(═O) 2 —, an ester group, or an amide group);
6) —P(═O)(—R TD26 )— (in which R TD26 represents an aryl group (for example, a phenyl group), an ester group, or an amide group);
7) —C(—Ph A )(—Ph A )—Ph—R TD27 —Ph—C(—Ph A )(—Ph A )(in which Ph represents a phenylene group, Ph A represents a phenyl group, and R TD27 's each independently represent —O—, an alkyl group (for example, an alkyl group having 1 to 6 carbon atoms), or an aryl group (for example, a phenyl group and a naphthyl group)); and
8) —O—(—R TD28 )—O— (in which R TD28 represents an alkylene group (for example, an alkylene group having 1 to 12 carbon atoms)); and

W 22 and W 23 represent atomic groups which are bonded to each other to form a substituted or unsubstituted condensed aromatic ring or a substituted or unsubstituted heterocycle.

5 . The semiconductor device package of claim 4 , wherein the tetracarboxylic dianhydride comprises 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 3,3′,4,4′-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3′,4,4′-biphenyl ether tetracarboxylic dianhydride, 3,3′,4,4′-dimethyldiphenylsilanetetracarboxylic dianhydride, 3,3′,4,4′-tetraphenylsilanetetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride, 4,4′-bis(3,4-dicarboxyphenoxy)diphenylpropane dianhydride, 3,3,4,4′-perfluoroisopropylidene diphthalic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, bis(phthalic acid)phenylphosphine oxide dianhydride, p-phenylene-bis(triphenylphthalic)dianhydride, m-phenylene-bis(triphenylphthalic)dianhydride, bis(triphenylphthalic acid)-4,4′-diphenyl ether dianhydride, bis(triphenylphthalic acid)-4,4′-diphenylmethane dianhydride, butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic dianhydride, 3,5,6-tricarboxynorbornane-2-acetic dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5-(2,5-dioxotetrahydrofuran))-3-methyl-3-cyclohexene-1,2-dicarboxylic dianhydride, and bicyclo[2,2,2]-oct-7-ene-2,3,5,6-tetracarboxylic dianhydride; and aliphatic tetracarboxylic dianhydrides having an aromatic ring, such as 1,3,3a,4,5,9b-hexahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-5-methyl-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-8-methyl-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-c]furan-1,3-dione, or any combination thereof.

6 . The semiconductor device package of claim 1 , wherein the functional group is an azole.

7 . The semiconductor device package of claim 6 , wherein the azole is an oxazole or an imidazole.

8 . The semiconductor device package of claim 1 , wherein the at least one diamine comprises a diamine benzoxazole and/or a diamine benzimidazole.

9 . The semiconductor device package of claim 1 , wherein the at least one diamine comprises a diamine benzoxazole and a diamine benzimidazole.

10 . The semiconductor device package of claim 8 , wherein the diamine benzoxazole comprises benzo[d]oxazole-2,5-diamine, benzo[d]oxazole-2,6-diamine, 2-(4-aminophenyl)benzo[d]oxazol-5-amine, 2-(4-aminophenyl)benzo[d]oxazol-6-amine, or a combination thereof.

11 . The semiconductor device package of claim 8 , wherein the diamine benzimidazole comprises 1H-benzo[d]imidazole-2,5-diamine, 1H-benzo[d]imidazole-2,6-diamine, 2-(4-aminophenyl)-1H-benzo[d]imidazol-5-amine, 2-(4-aminophenyl)-1H-benzo[d]imidazol-6-amine, or a combination thereof.

12 . The semiconductor device package of claim 9 , wherein a molar ratio of the repeating units derived from the diamine benzoxazole to the repeating units derived from the diamine benzimidazole is from about 30:70 to about 70:30.

13 . The semiconductor device package of claim 9 , wherein a molar ratio of the repeating units derived from the diamine benzoxazole to the repeating units derived from the diamine benzimidazole is from about 30:70 to about 50:50.

14 . The semiconductor device package of claim 9 , wherein a molar ratio of the repeating units derived from the diamine benzoxazole to the repeating units derived from the diamine benzimidazole is from about 35:65 to about 45:55.

15 . The semiconductor device package of claim 1 , wherein the adhesion promoting layer has a thickness from about 2 μm to about 25 μm.

16 . The semiconductor device package of claim 1 , wherein the first structure comprises an electrically insulative material.

17 . The semiconductor device package of claim 1 , wherein the first

Assignees

• Wolfspeed Inc

Inventors

• Dadvand Afshin
• Balaraman Devarajan
• Saxena Kuldeep

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/417

  Bonding materials between chips and die pads · CPC title