Electronic device module and method of manufacturing the same
US-11430742-B2 · Aug 30, 2022 · US
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Ryu Jong In patents
Ryu Jong In is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ryu Jong In |
| Total patents | 33 |
| First publication | May 14, 2015 |
| Latest publication | Aug 30, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic device module, method of manufacturing the same and electronic apparatus
US-11347273-B2 · May 31, 2022 · US
Electronic device module and method of manufacturing the same
US-11251135-B2 · Feb 15, 2022 · US
Electronic device module, method of manufacturing the same and electronic apparatus
US-11209872-B2 · Dec 28, 2021 · US
Electronic device module, method of manufacturing the same and electronic apparatus
US-2020409426-A1 · Dec 31, 2020 · US
Electronic device module, method of manufacturing the same and electronic apparatus
US-2020133347-A1 · Apr 30, 2020 · US
Electronic device module
US-10629542-B2 · Apr 21, 2020 · US
Electronic device module and method of manufacturing the same
US-2020098699-A1 · Mar 26, 2020 · US
Electronic device module, method of manufacturing the same and electronic apparatus
US-10564679-B2 · Feb 18, 2020 · US
Electronic device module and method of manufacturing the same
US-2019310687-A1 · Oct 10, 2019 · US
Recent patents
Latest publications not already listed above.
Electronic device module
US-2019311994-A1 · Oct 10, 2019 · US
Electronic device module and method of manufacturing the same
US-2019304926-A1 · Oct 3, 2019 · US
Electronic device module and method of manufacturing the same
US-10356911-B2 · Jul 16, 2019 · US
Electronic device module and manufacturing method thereof
US-10219380-B2 · Feb 26, 2019 · US
Semiconductor package with improved signal stability and method of manufacturing the same
US-10163746-B2 · Dec 25, 2018 · US
Double-sided package module and substrate strip
US-10109595-B2 · Oct 23, 2018 · US
Electronic device module and method of manufacturing the same
US-9997504-B2 · Jun 12, 2018 · US
Package and method of manufacturing the same
US-2017301632-A1 · Oct 19, 2017 · US
Package and method of manufacturing the same
US-9748179-B2 · Aug 29, 2017 · US
Double-sided package module and substrate strip
US-2017221835-A1 · Aug 3, 2017 · US
Electronic component module and manufacturing method thereof
US-9585260-B2 · Feb 28, 2017 · US
Electronic device module and method of manufacturing the same
US-2017018540-A1 · Jan 19, 2017 · US
Semiconductor package and method of manufacturing the same
US-2016315027-A1 · Oct 27, 2016 · US
Passive device and manufacturing method thereof
US-2016181242-A1 · Jun 23, 2016 · US
Semiconductor package and method of manufacturing the same
US-2016035678-A1 · Feb 4, 2016 · US
Electric device module and method of manufacturing the same
US-2016021737-A1 · Jan 21, 2016 · US
Electronic device module and method of manufacturing the same
US-2016007463-A1 · Jan 7, 2016 · US
Method for manufacturing interposer
US-9196506-B2 · Nov 24, 2015 · US
Electronic device module and manufacturing method thereof
US-2015289392-A1 · Oct 8, 2015 · US
Semiconductor package and method of manufacturing the same
US-2015228625-A1 · Aug 13, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 32 |
| Korea Electronics Technology | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 27 |
| H10W74/00 | 21 |
| H10W90/00 | 18 |
| H10W74/114 | 18 |
| H10W42/20 | 17 |