Electronic component module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9585260-B2
Application number	US-201414260007-A
Country	US
Kind code	B2
Filing date	Apr 23, 2014
Priority date	Feb 6, 2014
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

First claim

What is claimed is:

1. An electronic component module, comprising:
a substrate;
a plurality of electronic components mounted on both surfaces of the substrate;
connection conductors each having one end bonded to one surface of the substrate using a conductive adhesive and formed as a metal post; and
a molded portion having the connection conductor embedded therein and formed on one surface of the substrate,
wherein the connection conductor has at least one blocking member preventing a spread of the conductive adhesive,
wherein the blocking member protrudes from a portion of the connection conductor adjacent to one end of the connection conductor in an outer diameter direction thereof such that the blocking member is disposed between the center of the connection conductor and one end of the connection conductor,
wherein the blocking member is spaced apart from one end of the connection conductor bonded to the substrate, and
wherein the conductive adhesive is disposed between the blocking member and the substrate.

2. The electronic component module of claim 1 , wherein the spread of the conductive adhesive in a vertical direction and a horizontal direction is blocked by the blocking member.

3. The electronic component module of claim 2 , wherein an edge of the blocking member is chamfered to form a chamfered surface.

4. The electronic component module of claim 3 , wherein the conductive adhesive is formed to have a size corresponding to a range having a protruded length of the blocking member as a radius.

5. The electronic component module of claim 1 , wherein at least two of the connection conductors disposed to be adjacent to each other have respective blocking members disposed opposite to each other.

6. The electronic component module of claim 1 , further comprising a plurality of external connection terminals bonded to the connection conductors.

Assignees

• Samsung Electro Mech

Inventors

• Lim Jae Hyun
• Ryu Jong In
• Kim Sun Ho
• Jo Eun Jung
• Oh Kyu Hwan
• Yoo Do Jae

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/0198

  batch processes · CPC title

• H05K2201/10318

  Surface mounted metallic pins · CPC title