Electronic device module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9997504-B2
Application number	US-201615075824-A
Country	US
Kind code	B2
Filing date	Mar 21, 2016
Priority date	Jul 13, 2015
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

First claim

What is claimed is:

1. An electronic device module comprising:
a first board;
a first device mounted on a first surface of the first board;
a second board disposed below the first board; and
a plurality of second devices disposed between the first board and the second board,
wherein a surface of each second device of the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board,
the plurality of second devices includes an electronic component having a hexahedral shape,
each of the second devices have the same or similar thickness as each other,
the plurality of second devices comprises at least one electronic component and at least one dummy devices having no internal function, and
each dummy device comprise connection terminals disposed on upper and lower surfaces of a body.

2. The electronic device module of claim 1 , further comprising a plurality of external connection terminal disposed on a lower surface of the second board.

3. The electronic device module of claim 1 , wherein the plurality of second devices are bonded to the first and second boards through the connection terminals.

4. The electronic device module of claim 3 , wherein the first and second boards are electrically connected to each other through the connection terminals of the plurality of second devices.

5. The electronic device module of claim 1 , further comprising an encapsulation part encapsulating the first and second devices.

6. The electronic device module of claim 5 , wherein the first board is embedded in the encapsulation part.

7. The electronic device module of claim 5 , wherein a side surface of the first board is externally exposed.

8. An electronic device module comprising:
a first board;
a first device mounted on a first surface of the first board;
a second board disposed below the first board;
a plurality of second devices disposed between the first board and the second board, wherein surfaces of the plurality of second devices are bonded to a second surface of the first board and another surface of the plurality of second devices is bonded to the second board to form a plurality of gaps between the first board and the second board; and
an encapsulating part encapsulating the first board and one surface of the second board, wherein the gaps between the first board and second board accommodate portions of the encapsulating part,
wherein the plurality of second devices includes an electronic component having a hexahedral shape,
each of the second devices has the same or similar thickness as each other,
the plurality of second devices comprises at least one electronic component and at least one dummy device having no internal function, and
each dummy device comprises connection terminals disposed on upper and lower surfaces of a body.

9. The electronic device module of claim 8 , wherein the connection terminals are connected to the first board and the second board.

10. The electronic device module of claim 8 , wherein a surface of the first device is externally exposed.

11. The electronic device module of claim 8 , wherein side surfaces of the first board and the second board are externally exposed.

Assignees

• Samsung Electro Mech

Inventors

• Lim Jae Hyun
• Ryu Jong In
• Kim Sung Ho
• Kim Jin Su

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title