Electronic device module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11430742-B2
Application number	US-201916695597-A
Country	US
Kind code	B2
Filing date	Nov 26, 2019
Priority date	Apr 2, 2018
Publication date	Aug 30, 2022
Grant date	Aug 30, 2022

Abstract

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

First claim

What is claimed is:

1. An electronic device module comprising:
a substrate;
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein an electronic component mounted on the substrate is embedded in the second sealing portion, and the shielding portion is disposed on a surface of the second sealing portion, and
wherein the antenna comprises:
a dipole antenna disposed in an area overlapping the first sealing portion, in a view perpendicular to the surface of the substrate, or
a patch antenna disposed in an area overlapping an area in which the second sealing portion is disposed, in a view perpendicular to the surface of the substrate.

2. The electronic device module of claim 1 , wherein a circuit pattern disposed on the substrate forms the antenna.

3. The electronic device module of claim 1 , further comprising a connector disposed outside of the second sealing portion and mounted on the substrate.

4. The electronic device module of claim 1 , wherein at least one side surface of the second sealing portion is formed as a sloping surface.

5. The electronic device module of claim 1 , wherein the shielding portion is connected to a ground of the substrate.

6. The electronic device module of claim 5 , wherein the shielding portion is connected to a ground electrode disposed on the substrate through a groove formed between the first sealing portion and the second sealing portion.

7. The electronic device module of claim 1 , wherein the first sealing portion is spaced apart from the second sealing portion.

8. The electronic device module of claim 1 , wherein the first sealing portion has a thickness less than that of the second sealing portion.

9. An electronic device module comprising:
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion;
an electronic component embedded in the second sealing portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein the antenna overlaps the first sealing portion or the second sealing portion in a view perpendicular to the surface.

10. The electronic device module of claim 9 , wherein the shielding portion is disposed on the second sealing portion and electrically connected to a ground electrode on the substrate,
wherein the first sealing portion is spaced apart from the second sealing portion by the shielding portion.

11. The electronic device module of claim 9 , wherein the antenna comprises a dipole antenna or a patch antenna.

12. The electronic device module of claim 9 , wherein the antenna comprises a dipole antenna disposed to overlap the first sealing portion in a view perpendicular to the surface, or
wherein the antenna comprises a patch antenna disposed to overlap the second sealing portion in a view perpendicular to the surface.

13. An electronic device module comprising:
a sealing portion comprising a first sealing portion and a second sealing portion disposed on a surface of the substrate, wherein the first sealing portion and the second sealing portion are separated by a shielding portion and in direct contact with the shielding portion;
an electronic component embedded in the second sealing portion; and
an antenna disposed below the surface on a layer in the substrate,
wherein the antenna is a dipole antenna and overlaps the first sealing portion or a patch antenna and overlaps the second sealing portion in a view perpendicular to the surface of the substrate.

14. The electronic device module of claim 13 , wherein the shielding portion is disposed on the second sealing portion and electrically connected to a ground electrode on the substrate.

15. The electronic device module of claim 14 , wherein the first sealing portion is spaced apart from the second sealing portion by the shielding portion.

16. The electronic device module of claim 13 , wherein the first sealing portion is disposed along an edge of the substrate.

17. The electronic device module of claim 16 , wherein the first sealing portion is disposed along two consecutive edges of the substrate.

Assignees

• Samsung Electro Mech

Inventors

• Ryu Jong In
• Hong Suk Youn
• Chi Gi Su
• Hong Seung Hyun
• Kim Ki Chan

Classifications

• H10W44/248

  for antennas · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title