Electronic device module, method of manufacturing the same and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10564679-B2
Application number	US-201816181485-A
Country	US
Kind code	B2
Filing date	Nov 6, 2018
Priority date	Apr 5, 2018
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

First claim

What is claimed is:

1. An electronic device module comprising:
a substrate;
a sealing portion disposed on a first surface of the substrate;
a first component disposed outside of the sealing portion on the first surface of the substrate;
a second component disposed on the first surface of the substrate and embedded in the sealing portion; and
a shielding wall at least partially disposed between the first component and the second component, and comprising a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

2. The electronic device module of claim 1 , wherein the shielding wall and the first component are spaced apart with an empty space therebetween, and the sealing portion is disposed between the shielding wall and the second component.

3. The electronic device module of claim 1 , wherein the shielding wall is a square ring, and the first component is disposed in an internal space defined by the shielding wall.

4. The electronic device module of claim 1 , wherein the shielding wall comprises two walls connected to each other, and at least one of the two walls is disposed between the first component and the second component.

5. The electronic device module of claim 1 , wherein the shielding wall extends across an entire width of the first surface of the substrate.

6. The electronic device module of claim 1 , wherein the substrate comprises a ground electrode, and the shielding wall is bonded to the ground electrode.

7. The electronic device module of claim 1 , further comprising:
a shielding layer disposed along a surface of the sealing portion.

8. The electronic device module of claim 7 , wherein the shielding layer is connected to an upper end of the shielding wall.

9. The electronic device module of claim 7 , wherein the shielding layer and the shielding wall are formed of different materials.

10. The electronic device module of claim 7 , wherein the sealing portion comprises a first sealing portion without the shielding layer and connected to the shielding wall, a second sealing portion provided with the shielding layer, and a third sealing portion without the shielding layer and having a thickness, with respect to the first surface of the substrate, that is less than a thickness of the first sealing portion and a thickness of the second sealing portion, and
further comprising an antenna disposed on or in a portion of the substrate that overlaps the third sealing portion.

11. A method of manufacturing an electronic device module, comprising:
mounting a first component and a second component on a first surface of a substrate;
mounting a shielding case formed of a conductive material and defining a receiving space on the first surface of the substrate so that the first component is accommodated in the receiving space;
disposing a sealing portion sealing the second component and the shielding case on the first surface of the substrate; and
exposing the receiving space to the outside of the sealing portion by partially removing the sealing portion and the shielding case.

12. The method of claim 11 , further comprising:
forming a shielding layer on a surface of the sealing portion before exposing the receiving space to the outside of the sealing portion.

13. The method of claim 12 , wherein the forming of the shielding layer comprises partially exposing the shielding case by partially removing the sealing portion, and disposing the shielding layer on a surface of the sealing portion and the partially exposed shielding case.

14. The method of claim 13 , wherein the partially exposing of the shielding case is performed by removing an upper surface of the sealing portion using a grinder until the shielding case is exposed.

15. The method of claim 13 , wherein the partially exposing of the shielding case is performed by exposing only a portion of the shielding case that corresponds to a wall disposed between the first component and the second component using a blade or a laser.

16. The method of claim 11 , wherein the exposing of the receiving space to the outside of the sealing portion comprises partially removing the sealing portion and the shielding case using a grinder.

17. An apparatus comprising:
an electronic device module comprising
a substrate,
a sealing portion disposed on the first surface of the substrate,
a first component disposed outside of the sealing portion on the first surface of the substrate,
a second component disposed on the first surface of the substrate and embedded in the sealing portion,
a shielding structure at least partially disposed between the first component and the second component, and
an antenna disposed on a second surface of the substrate opposite the first surface or inside the substrate at a position that overlaps the first component.

18. The apparatus of claim 17 , wherein the shielding structure comprises a first wall disposed between the first component and the second component.

19. The apparatus of claim 18 , wherein the first wall has a height above the first surface of the substrate that is shorter than a height of the sealing portion.

20. The apparatus of claim 18 , wherein the shielding structure comprises a second wall, the first wall has a height above the first surface of the substrate that is equal to a height of the sealing portion, and the second wall has a height above the first surface of the substrate that is shorter than the height of the sealing portion.

Assignees

• Samsung Electro Mech

Inventors

• Hong Suk Youn
• Ryu Jong In
• Hong Seung Hyun
• Kim Jang Hyun

Classifications

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title

• H05K2203/025

  Abrading, e.g. grinding or sand blasting · CPC title

• H05K2201/09972

  Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K3/288

  Removal of non-metallic coatings, e.g. for repairing · CPC title