Electronic device module

Patent metadata

Field	Value
Publication number	US-10629542-B2
Application number	US-201816181397-A
Country	US
Kind code	B2
Filing date	Nov 6, 2018
Priority date	Apr 5, 2018
Publication date	Apr 21, 2020
Grant date	Apr 21, 2020

Abstract

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

First claim

What is claimed is:

1. An electronic device module comprising: a substrate;
a first component and at least a second component disposed on one surface of the substrate;
a shielding wall disposed between the first component and the second component, and disposed on the substrate; and
a sealing portion comprising the at first component, the second component and the shielding wall embedded therein, and disposed on the substrate,
wherein the shielding wall comprises:
an insulating layer,
a first conductive layer disposed on a first surface of the insulating layer,
a second conductive layer disposed on a second surface of the insulating layer opposing the first surface, and
an interlayer connecting conductor disposed in the insulating layer penetrating through the insulating layer from the first surface to the second surface to electrically connect the first conductive layer to the second conductive layer, and
a shielding layer disposed on a surface of the sealing portion,
wherein the first and second conductive layers are electrically connected to the shielding layer.

2. The electronic device module of claim 1 , wherein the substrate comprises a ground electrode disposed to be exposed to the outside of the sealing portion and electrically connected to the shielding layer.

3. The electronic device module of claim 1 , further comprising a bonding layer of a conductive material disposed on a lower end surface of the shielding wall opposing the substrate and on an upper end surface of the shielding wall connected to the shielding layer.

4. The electronic device module of claim 1 , further comprising:
a conductive adhesive agent disposed between the shielding wall and the substrate.

5. The electronic device module of claim 1 , wherein the shielding wall further comprises:
an insulating film disposed between each of the first conductive layer and the sealing portion and the second conductive layer and the sealing portion.

6. The electronic device module of claim 1 , wherein the interlayer connecting conductor comprises a conductive material disposed in a through-hole penetrating through the insulating layer.

7. The electronic device module of claim 1 , wherein the substrate comprises a ground electrode disposed on a lower portion of the shielding wall and connected to the first and second conductive layers.

8. The electronic device module of claim 1 , wherein the layers of the shielding wall further comprise an external insulating layer disposed on an external surface of one or more of the first and second conductive layers.

9. The electronic device module of claim 5 , wherein the insulating film comprises an oxide film.

10. The electronic device module of claim 6 , wherein the shielding wall comprises a plurality of interlayer connecting conductors penetrating through the insulating layer and electrically connecting the first and second conductive layers on the opposing surfaces.

11. The electronic device module of claim 10 , wherein the interlayer connecting conductors comprise a first connecting conductor disposed in the insulating layer and a second connecting conductor disposed on an edge of the insulating layer.

12. The electronic device module of claim 11 , wherein at least a portion of the second connecting conductor is disposed to be exposed to an upper end surface or a lower end surface of the shielding wall.

13. The electronic device module of claim 12 , wherein the second connecting conductor is formed in smaller size than a size of the first connecting conductor.

14. An electronic device module, comprising: a first circuit substrate including a ground electrode;
at least one first component and at least one second component disposed on one surface of the first circuit substrate;
a second circuit substrate disposed between the at least one first component and the at least one second component and disposed on the first circuit substrate to be substantially perpendicular to the first circuit substrate; and
a sealing portion having the at least one first component, the at least one second component and the second circuit substrate embedded therein, and disposed on the substrate,
wherein the second circuit substrate comprises an insulating layer, two wiring layers disposed on opposing surfaces of the insulating layer, and a plurality of interlayer connecting conductors penetrating through the insulating layer to connect the two wiring layers to each other,
wherein a wiring layer on the second circuit substrate is connected to the ground electrode on the first circuit substrate, and
a shielding layer disposed on a surface of the sealing portion,
wherein the first and second conductive layers are electrically connected to the shielding layer.

15. The electronic device module of claim 14 , wherein the plurality of interlayer connecting conductors penetrating through the insulating layer each comprise a conductive material disposed in a through-hole penetrating through the insulating layer.

16. An electronic device module, comprising:
a first substrate comprising a first region and a second region on a surface;
a first component disposed in the first region;
a second component disposed in the second region;
a second substrate disposed on the surface and extending from the surface to divide the surface into the first region and the second region,
a first sealing portion embedding the first component;
a second sealing portion embedding the second component;
wherein the second substrate comprises:
an insulating layer;
a first conductive layer on one surface of the insulating layer facing the first region and a second conductive layer on an opposite surface of the insulating layer facing the second region;
interlayer conductors each comprising a conductive material disposed in a through-hole penetrating through the insulating layer to electrically connect the first and second conductive layers,
wherein the first and second conductive layers are electrically connected to the first substrate, and
a shielding layer disposed on the first and second sealing portions electrically connected to the first and second conductive layers,
wherein the second substrate is embedded in the first and second sealing portions.

17. The electronic device module of claim 16 , wherein the first region and the second region are electromagnetically shielded from each other by the second substrate.

18. The electronic device module of claim 16 , wherein the second substrate further comprises an insulating film disposed on the first and second conductive layers,
wherein the first and second conductive layers are connected to a ground layer, and
wherein the conductive material of one or more of the interlayer conductors is disposed as a coating on an internal wall of the corresponding through-hole.

Assignees

• Samsung Electro Mech

Inventors

• Hong Suk Youn
• Kim Jang Hyun
• Kim Hye Kyung
• Hong Seung Hyun
• Ryu Jong In

Classifications

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H05K2201/09609

  Via grid, i.e. two-dimensional array of vias or holes in a single plane · CPC title

• H05K1/0224

  Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence) · CPC title

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title