Electronic device module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10356911-B2
Application number	US-201514732550-A
Country	US
Kind code	B2
Filing date	Jun 5, 2015
Priority date	Jul 4, 2014
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

First claim

What is claimed is:

1. An electronic device module comprising:
a board comprising a mounting electrode, an external connection electrode in direct contact with the board, and a protective insulation layer disposed on an outer surface of the board and a side surface and an outer surface of the external connection electrode;
an electronic device mounted on the mounting electrode;
a molded part sealing the electronic device; and
a connective conductor of which one end is bonded to the outer surface of the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part,
wherein the protective insulation layer on the outer surface of the external connection electrode is spaced apart from the connective conductor on the outer surface of the external connection electrode by a predetermined distance,
wherein a portion of the molded part is bonded to the external connection electrode, and
wherein an insulation film is interposed between the molded part and the external connection electrode.

2. The electronic device module of claim 1 , wherein the molded part is disposed on the outer surface of the external connection electrode and interposed between the protective insulation layer and the connective conductor.

3. The electronic device module of claim 1 , wherein the protective insulation layer covers a portion of the external connection electrode.

4. The electronic device module of claim 1 , wherein the molded part is formed of an epoxy molding compound (EMC).

5. The electronic device module of claim 1 , further comprising an external terminal coupled to another end of the connective conductor opposite to the one end of connective conductor that is bonded to the external connection electrode.

6. The electronic device module of claim 1 , wherein the protective insulation layer extends from the outer surface of the board along the side surface of the external connection electrode to a predetermined distance greater than the side surface of the external connection electrode.

7. An electronic device module comprising:
a board comprising a mounting electrode and an external connection electrode each directly disposed on an outer surface of the board, the external connection electrode comprising an inner surface disposed facing the board and opposite an outer surface spaced apart from the inner surface by a side surface, the outer surface comprising a central portion, an edge portion, and a space portion separating the central portion from the edge portion by a predetermined distance;
an electronic device mounted on the mounting electrode;
a protective insulation layer disposed on the outer surface of the board and on the side surface and the edge portion of the outer surface of the external connection electrode;
a molded part sealing the electronic device and disposed on the space portion of the connection surface of the external connection electrode; and
a connective conductor extending through the molded part, bonded to the central portion of the outer surface of the external connection electrode, and spaced apart from the edge portion,
wherein an insulation film is interposed between the molded part and the external connection electrode.

8. An electronic device module comprising:
a board comprising:
a mounting electrode,
an external connection electrode in direct contact with the board, and comprising an inner surface disposed facing the board and opposite an outer surface spaced apart from the inner surface by a side surface, and
a protective insulation layer disposed on an outer surface of the board and spaced apart from the side surface of the external connection electrode by a first predetermined distance;

an electronic device mounted on the mounting electrode;
a molded part sealing the electronic device; and
a connective conductor of which one end is bonded to the outer surface of the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part,
wherein the one end of the connective conductor bonded to the outer surface of the external connection electrode of the board is spaced apart from the insulation layer on the outer surface of the board by a second predetermined distance.

9. The electronic device module of claim 8 , wherein the first predetermined distance is substantially the same as the second predetermined distance.

10. The electronic device module of claim 8 , wherein the first predetermined distance is less than the second predetermined distance.

11. The electronic device module of claim 8 , wherein the first predetermined distance is greater than the second predetermined distance.

12. The electronic device module of claim 8 , wherein the protective insulation layer extends from the outer surface of the board along the first predetermined distance from the side surface of the external connection electrode to a predetermined distance greater than a distance between the inner surface and the outer surface of the external connection electrode.

13. The electronic device module of claim 8 , wherein the protective insulation layer extends from the outer surface of the board along the first predetermined distance from the side surface of the external connection electrode to a predetermined distance less than a distance between the inner surface and the outer surface of the external connection electrode.

14. The electronic device module of claim 8 , wherein the molded part is interposed between the protective insulation layer and the connective conductor.

15. The electronic device module of claim 8 , wherein a portion of the molded part is bonded to the external connection electrode.

16. The electronic device module of claim 15 , wherein an insulation film is interposed between the molded part and the external connection electrode.

17. The electronic device module of claim 8 , wherein the molded part is formed of an epoxy molding compound (EMC).

18. The electronic device module of claim 8 , further comprising an external terminal coupled to another end of the connective conductor opposite to the one end of connective conductor that is bonded to the external connection electrode.

Assignees

• Samsung Electro Mech

Inventors

• Yoo Do Jae
• Lim Jae Hyun
• Ryu Jong In
• Oh Kyu Hwan
• Lee Ki Ju

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L2924/19106

  Electricity · mapped topic