Surface treatment producing high conductivity vias with simultaneous polymer adhesion
US-12460291-B2 · Nov 4, 2025 · US
This page is not indexed by search engines while we improve data quality.
Riemer Douglas P patents
Riemer Douglas P is listed as an inventor on 60 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Riemer Douglas P |
| Total patents | 60 |
| First publication | Jul 21, 2016 |
| Latest publication | Nov 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
High aspect ratio electroplated structures and anisotropic electroplating processes
US-12378687-B2 · Aug 5, 2025 · US
Miniature pressure/force sensor with integrated leads
US-12216013-B2 · Feb 4, 2025 · US
Microetch neutralizer chemistry for Ni—Au plating defect elimination
US-12195870-B2 · Jan 14, 2025 · US
Gold electroplating solution and method
US-12173423-B2 · Dec 24, 2024 · US
Sensored battery pouch
US-12159983-B2 · Dec 3, 2024 · US
Sensor shift structures in optical image stabilization suspensions
US-12147059-B2 · Nov 19, 2024 · US
Sensor shift structures in optical image stabilization suspensions
US-12044219-B2 · Jul 23, 2024 · US
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
US-2024170208-A1 · May 23, 2024 · US
Etch Chemistry For Metallic Materials
US-2024102174-A1 · Mar 28, 2024 · US
Recent patents
Latest publications not already listed above.
Electroless nickel etch chemistry, method of etching and pretreatment
US-11932948-B2 · Mar 19, 2024 · US
Miniature Pressure/Force Sensor With Integrated Leads
US-2024068889-A1 · Feb 29, 2024 · US
Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces
US-11898264-B2 · Feb 13, 2024 · US
Etch chemistry for metallic materials
US-11873564-B2 · Jan 16, 2024 · US
Miniature pressure/force sensor with integrated leads
US-11867575-B2 · Jan 9, 2024 · US
Electrode tabs and methods of forming
US-11791521-B2 · Oct 17, 2023 · US
Shape memory alloy wire attachment structures for a suspension assembly
US-11782286-B2 · Oct 10, 2023 · US
Systems for electroplating and methods of use thereof
US-11713514-B2 · Aug 1, 2023 · US
Plating method to reduce or eliminate voids in solder applied without flux
US-11674235-B2 · Jun 13, 2023 · US
High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes
US-2022351893-A1 · Nov 3, 2022 · US
High-aspect ratio electroplated structures and anisotropic electroplating processes
US-11387033-B2 · Jul 12, 2022 · US
Surface Treatment Producing High Conductivity Vias With Simultaneous Polymer Adhesion
US-2022205080-A1 · Jun 30, 2022 · US
Miniature Pressure/Force Sensor With Integrated Leads
US-2022196494-A1 · Jun 23, 2022 · US
Sensored battery electrode
US-11322806-B2 · May 3, 2022 · US
Electroless Nickel Etch Chemistry, Method Of Etching And Pretreatment
US-2022127729-A1 · Apr 28, 2022 · US
Sensor Shift Structures In Optical Image Stabilization Suspensions
US-2022099072-A1 · Mar 31, 2022 · US
Treatment Methods And Solutions For Improving Adhesion Of Gold Electroplating On Metal Surfaces
US-2022090284-A1 · Mar 24, 2022 · US
Microetch Neutralizer Chemistry For Ni-Au Plating Defect Elimination
US-2022074067-A1 · Mar 10, 2022 · US
Miniature pressure/force sensor with integrated leads
US-11243127-B2 · Feb 8, 2022 · US
Sensor shift structures in optical image stabilization suspensions
US-11199182-B2 · Dec 14, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hutchinson Technology | 60 |
| Mound Laser & Photonics Center Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/00 | 17 |
| C25D3/48 | 11 |
| C25D5/02 | 11 |
| C25D5/18 | 8 |
| G02B27/646 | 8 |