High aspect ratio electroplated structures and anisotropic electroplating processes

Patent metadata

Field	Value
Publication number	US-12378687-B2
Application number	US-202016827583-A
Country	US
Kind code	B2
Filing date	Mar 23, 2020
Priority date	Nov 18, 2016
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.

First claim

What is claimed is:

1. A method for manufacturing a metal structure comprising:
providing a substrate having a first trace having an initial height to width aspect ratio, wherein a first dielectric layer is formed using a thin dielectric process disposed over the substrate;
electroplating a metal crown on at least the first trace to form the metal crown with a final height to width aspect ratio greater than the initial height to width aspect ratio of the first trace, wherein the metal crown is formed over at least a portion of the first trace on a top surface and sidewalls of the first trace, wherein a distance between the first trace to a second trace disposed on the substrate tunes an impedance of the first trace, wherein the first dielectric layer fills spaces between the first trace and the second trace and provides a coating over the first trace and the second trace, wherein the electroplating comprises:
adjusting a current density based on an amount of copper and/or an amount of leveler additive to the plating solution included in a plating bath, wherein the metal crown is selectively formed over at least the portion of the first trace based on a concentration of a metal in the plating bath or a current density of the plating bath;

forming at least a third trace and a fourth trace over the first dielectric layer; and
forming a second dielectric layer over the third trace and the fourth trace using the thin dielectric process to fill spaces between the third trace and the fourth trace and coat over the third trace and the fourth trace, wherein a thickness of the second dielectric layer between a top of the second dielectric layer and a top of the third trace and the fourth trace is less than a thickness of the first dielectric layer between the first dielectric layer and the substrate.

2. The method of claim 1 , wherein electroplating the metal crown includes depositing metal on upper portions and side portions of the first trace, and wherein a rate of deposition on the upper portions of the first trace is greater than a rate of deposition on side portions of the first trace.

3. The method of claim 1 , wherein electroplating the metal crown includes depositing metal substantially only on upper portions of the first trace.

4. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where the final height to width aspect ratio is greater than or equal to 1.2.

5. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where a height of the metal structure is greater than twice a height of the first trace.

6. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where a width of the metal structure is less than or equal to twice a width of the first trace.

7. The method of claim 1 , further comprising:
forming two or more adjacent structures adjacent to the substrate, and wherein a spacing between the two or more adjacent structures before the electroplating is less than or equal to 1.5 times the width of the first trace and the second trace.

8. The method of claim 1 , wherein providing the substrate having the first trace includes electroplating the first trace onto the substrate.

9. The method of claim 1 , wherein providing the substrate having the first trace includes:
providing a laminate including a substrate and a metal layer optionally separated by an insulating layer; and
etching the metal layer to form the first trace.

10. The method of claim 1 , wherein electroplating the metal crown includes:
a conformal electroplating phase using a first current density; and
an anisotropic electroplating phase using a second current density that is greater than the first current density, after the conformal electroplating phase.

11. The method of claim 1 , wherein the metal structure is used for manufacturing products including integrated lead flexures, coils including multi-layer and helical coils and/or camera lens suspension components.

12. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where the final height to width aspect ratio is greater than or equal to 2.0.

13. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where a height of the metal structure is greater than or equal to 2.4 times a height of the first trace.

14. The method of claim 1 , wherein electroplating includes electroplating to form the metal structure where a width of the metal structure is less than or equal to 1.7 times a width of the first trace.

15. The method of claim 1 , further comprising:
forming two or more adjacent metal structures on the substrate, and wherein a spacing between the two or more adjacent metal structures before the electroplating is less than or equal to about 1.0 times a width of the first trace and the second trace.

16. The method of claim 1 , wherein the substrate is a metal.

17. The method of claim 1 , wherein the substrate is a polymer.

18. The method of claim 1 wherein the thin dielectric process includes use of liquid photosensitive polyimide.

Assignees

• Hutchinson Technology

Inventors

• Riemer Douglas P
• Swanson Kurt C
• Ladwig Peter F

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• Y10T428/24917

  including metal layer · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title