High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes

Patent metadata

Field	Value
Publication number	US-2022351893-A1
Application number	US-202217862183-A
Country	US
Kind code	A1
Filing date	Jul 11, 2022
Priority date	Nov 18, 2016
Publication date	Nov 3, 2022
Grant date	—

Abstract

A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

First claim

What is claimed is:

1 . A method comprising:
disposing a dielectric layer on a conductive substrate; forming a first set of high-aspect ratio electroplated structures from at least a portion of a second set of traces on the conductive substrate, the first set of high-aspect ratio electroplated structures disposed on a first surface of the dielectric layer; forming a second set of high-aspect ratio electroplated structures from at least a portion of a second set of traces included on the dielectric layer, the set of high-aspect ratio electroplated structures disposed on a second surface of the dielectric layer.

2 . The method of claim 1 , further comprising:
disposing a second dielectric layer on the first set of high-aspect ratio electroplated structures.

3 . The method of claim 1 , further comprising:
disposing a third dielectric layer on the second set of high-aspect ratio electroplated structures.

4 . The method of claim 1 , wherein the dielectric layer includes a via to electrically couple at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures with at least one high-aspect ratio electrical plated structure of the second set of high-aspect ratio electroplated structures.

5 . The method of claim 1 , wherein the first set of high-aspect ratio electroplated structures and the second set of high-aspect ratio electroplated structures are configured to form an inductive coupling coil.

6 . The method of claim 1 , further comprising:
forming a coil having two outer coil sections and an inner coil section between the two outer coils.

7 . The method of claim 1 , further comprising:
disposing a first terminal pad coupled with at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures.

8 . The method of claim 7 , wherein the first terminal pad is a nickel terminal plated with a gold layer.

9 . The method of claim 1 , further comprising:
forming at least a portion of the first set of high-aspect ratio electroplated structures using a crown plating process.

10 . The method of claim 1 , wherein the second set of high-aspect ratio electroplated structures are formed by etching the conductive substrate.

11 . The method of claim 1 , further comprising:
forming a first metal crown portion over at least a portion of each trace of the second set of traces using a crown plating process.

12 . A method for manufacturing a coil, the method comprising:
etching or plating a conductive substrate to form a first plurality of traces; disposing a dielectric layer on the conductive substrate; disposing a second plurality of traces on the dielectric layer; forming a first set of high-aspect ratio electroplated structures disposed on the dielectric layer; and forming a second set of high-aspect ratio electroplated structures disposed on a surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

13 . The method of claim 12 , wherein the dielectric layer includes a via to electrically couple at least one high-aspect ratio electrical plated structure of the first set of high-aspect ratio electroplated structures with at least one high-aspect ratio electrical plated structure of the second set of high-aspect ratio electroplated structures.

14 . The method of claim 12 , wherein the first set of high-aspect ratio electroplated structures and the second set of high-aspect ratio electroplated structures form a first coil section of the coil.

15 . The method of claim 14 , further comprising:
forming a third set of high-aspect ratio electroplated structures and a fourth set of high-aspect ratio electroplated structures to form a second coil section of the coil.

16 . The method of claim 15 , further comprising:
forming a fifth set of high-aspect ratio electroplated structures and a sixth set of high-aspect ratio electroplated structures to form a third coil section of the coil.

17 . The method of claim 16 , wherein the first coil section is electrically coupled with the second coil section and the third coil section.

18 . The method of claim 16 , wherein the second coil section is electrically coupled with the third coil section.

19 . The method of claim 12 , wherein the second set of high-aspect ratio electroplated structures are formed by etching the conductive substrate.

20 . The method of claim 19 , wherein at least a portion of the second set of high-aspect ratio electroplated structures are formed using a crown plating process.

Assignees

• Hutchinson Technology

Inventors

• Riemer Douglas P
• Swanson Kurt C
• Ladwig Peter F
• Lang Matthew S
• Pesavento Paul V
• Starkey Joseph D

Classifications

• H01F41/042

  by thin film techniques · CPC title

• H01F5/00

  Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title