Method of forming metallic pattern on polymer substrate
US-2015376809-A1 · Dec 31, 2015 · US
Electroplating of selected surface areas
Electroplating of selected surface areas · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/02 |
| Official title | Electroplating of selected surface areas |
| Display label | Electroplating of selected surface areas |
| Total patents | 887 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 98 |
| 2016 | 100 |
| 2017 | 75 |
| 2018 | 68 |
| 2019 | 100 |
| 2020 | 69 |
| 2021 | 91 |
| 2022 | 80 |
| 2023 | 81 |
| 2024 | 61 |
| 2025 | 58 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating method
US-2015376807-A1 · Dec 31, 2015 · US
Conductive substrate and method for manufacturing same
US-2015359109-A1 · Dec 10, 2015 · US
Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates
US-2015348772-A1 · Dec 3, 2015 · US
Interposer fabricating process and wafer packaging structure
US-2015348892-A1 · Dec 3, 2015 · US
Printed circuit board, method for maufacturing the same and package on package having the same
US-2015342046-A1 · Nov 26, 2015 · US
Nickel-plated steel sheet for manufacturing pipe having corrosion resistance against fuel vapors, pipe which uses the steel sheet, and fuel supply pipe which uses the steel sheet
US-9194530-B2 · Nov 24, 2015 · US
Devices, Systems and Methods for Coating Surfaces
US-2015322583-A1 · Nov 12, 2015 · US
Super conformal metal plating from complexed electrolytes
US-2015325477-A1 · Nov 12, 2015 · US
Electrolyte concentration control system for high rate electroplating
US-2015315720-A1 · Nov 5, 2015 · US
Miniature RF and Microwave Components and Methods for Fabricating Such Components
US-2015311575-A1 · Oct 29, 2015 · US
Shrouded single crystal dual alloy turbine disk
US-2015308273-A1 · Oct 29, 2015 · US
Selective plating without photoresist
US-2015311161-A1 · Oct 29, 2015 · US
Lighting device, in particular contour lighting for a motor vehicle
US-2015298604-A1 · Oct 22, 2015 · US
Copper plating bath composition
US-2015299883-A1 · Oct 22, 2015 · US
Cathode for thin film microbattery
US-2015288023-A1 · Oct 8, 2015 · US
Anodized electroplated aluminum structures
US-2015284868-A1 · Oct 8, 2015 · US
Homogeneous solid metallic anode for thin film microbattery
US-2015288024-A1 · Oct 8, 2015 · US
Device for fixedly securing a metallic inlay
US-9150978-B2 · Oct 6, 2015 · US
Method for the Nanostructuring and Anodization of a Metal Surface
US-2015275387-A1 · Oct 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/02?
- CPC C25D5/02 is the Cooperative Patent Classification code for “Electroplating of selected surface areas.”
- How many patents are filed under CPC C25D5/02 (Electroplating of selected surface areas)?
- Our database includes 887 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/02 growing?
- Publication counts under this code: 61 in 2024 vs 58 in 2025 (latest complete years).