Gold electroplating solution and method

Patent metadata

Field	Value
Publication number	US-12173423-B2
Application number	US-202016794060-A
Country	US
Kind code	B2
Filing date	Feb 18, 2020
Priority date	Jan 16, 2015
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

First claim

The invention claimed is:

1. A gold electroplating solution consisting of:
a gold (III) cyanide compound, the gold (III) cyanide compound being at least one of potassium gold (III) cyanide, ammonium gold (III) cyanide, and sodium gold (III) cyanide;
a chloride compound, the chloride compound being ammonium chloride; and
hydrochloric acid,
wherein the hydrochloric acid is supplied in a sufficient amount such that the gold electroplating solution has a pH less than about 1, and wherein the gold electroplating solution is free of each of ethylenediamine hydrochloride, oxidizing acids, and nitrate salts, wherein a stainless steel surface with at least one photoresist pattern for a circuit structure is configured to be immersed in the gold electroplating solution to electroplate gold from the gold electroplating solution onto the stainless steel surface.

2. The solution of claim 1 , wherein the solution has a pH between about 0.7 and about 0.9.

3. The solution of claim 1 , wherein a concentration of the gold (III) cyanide compound is between about 1.0 grams of gold per liter of solution and 3.0 grams of gold per liter of solution, and a concentration of chloride anions is between about 0.30 moles per liter of solution and 0.60 moles per liter of solution.

4. The solution of claim 3 , wherein a concentration of the gold (III) cyanide compound is between about 1.8 grams of gold per liter of solution and 2.2 grams of gold per liter of solution, and a concentration of chloride anions is between about 0.45 moles per liter of solution and 0.55 moles per liter of solution.

5. The aqueous solution of claim 1 , wherein the solution is free of nitric acid.

Assignees

• Hutchinson Technology

Inventors

• Swanson Kurt C
• Riemer Douglas P
• Fank Steven A

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D5/36

  of iron or steel · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• C25D5/627

  Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance · CPC title

• C25D5/611

  Smooth layers · CPC title