Miniature pressure/force sensor with integrated leads

Patent metadata

Field	Value
Publication number	US-11867575-B2
Application number	US-202217587865-A
Country	US
Kind code	B2
Filing date	Jan 28, 2022
Priority date	Feb 3, 2016
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

First claim

The invention claimed is:

1. A pressure/force sensor comprising:
a diaphragm structure including a sensing element;
a lead structure extending from the diaphragm structure, the lead structure including first and second traces electrically coupled to the sensing element, wherein the first trace is electrically connected to a first electrode, and wherein the second trace is electrically connected to a second electrode; and
wherein the diaphragm structure and the lead structure include a circuit assembly comprising:
a common insulating layer;
a via connecting the second electrode to the second trace through the common insulating layer; and
a common conductor layer on the insulating layer, including at least a portion of the sensing element and at least the first trace.

2. The sensor of claim 1 wherein:
the diaphragm structure includes a base and defines a void region; and
the insulating layer and the conductor layer including the at least the portion of the sensing element are on the base and extend over the void region.

3. The sensor of claim 2 wherein the base includes a metal member.

4. The sensor of claim 3 wherein the metal member of the base is a stainless steel member.

5. The sensor of claim 4 wherein the portion of the sensing element included in the conductor layer includes the first electrode.

6. The sensor of claim 5 wherein:
the base includes a moving portion; and
the first electrode is on the moving portion.

7. The sensor of claim 6 wherein the base further includes spring arms extending from the moving portion.

8. The sensor of claim 4 wherein:
the sensing element further includes the second electrode; and
the second electrode is coupled to the second trace.

9. The sensor of claim 2 wherein:
the sensing element includes a strain gauge; and
the conductor layer includes the first and second traces.

10. A pressure/force sensor, comprising:
a circuit assembly including a diaphragm portion and a lead portion including:

an insulating layer;
a conductor layer including a sensor structure at the diaphragm portion and at least one trace at the lead portion that is connected to the sensor structure, the at least one trace including a first trace that is electrically connected to a first electrode, and a second trace electrically connected to a second electrode, the second electrode connected to the second trace through the insulating layer by a via; and
a base, wherein the diaphragm portion of the circuit assembly is attached to the base.

11. The sensor of claim 10 wherein the base includes a stainless steel member.

12. The sensor of claim 11 wherein:
the stainless steel member of the base includes a moving portion; and
the diaphragm portion of the circuit assembly is attached to the base.

13. The sensor of claim 12 wherein the stainless steel member of the base includes spring arms extending from the moving member.

Assignees

• Hutchinson Technology

Inventors

• Davis Michael W
• Ladwig Peter F
• Lang Matthew S
• Myers Dean E
• Olsen Clark T
• Riemer Douglas P

Classifications

• G01L1/2268 Primary

  Arrangements for correcting or for compensating unwanted effects · CPC title

• G01L1/146

  for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence) · CPC title