Miniature Pressure/Force Sensor With Integrated Leads

Patent metadata

Field	Value
Publication number	US-2022196494-A1
Application number	US-202217587865-A
Country	US
Kind code	A1
Filing date	Jan 28, 2022
Priority date	Feb 3, 2016
Publication date	Jun 23, 2022
Grant date	—

Abstract

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

First claim

1 . A pressure/force sensor comprising:
a diaphragm structure including a sensing element; a lead structure extending from the diaphragm structure, the lead structure including first and second traces electrically coupled to the sensing element; and wherein the diaphragm structure and the lead structure include a circuit assembly comprising:
a common insulating layer; and
a common conductor layer on the insulating layer, including at least a portion of the sensing element and at least the first trace.

2 . The sensor of claim 1 wherein:
the diaphragm structure includes a base and defines a void region; and
the insulating layer and the conductor layer including the at least the portion of the sensing element are on the base and extend over the void region.

3 . The sensor of claim 2 wherein the base includes a metal member.

4 . The sensor of claim 3 wherein the metal member of the base is a stainless steel member.

5 . The sensor of claim 4 wherein the portion of the sensing element included in the conductor layer includes a first electrode.

6 . The sensor of claim 5 wherein:
the base includes a moving portion; and
the electrode is on the moving portion.

7 . The sensor of claim 6 wherein the base further includes spring arms extending from the moving portion.

8 . The sensor of claim 4 wherein:
the sensing element further includes a second electrode; and
the second electrode is coupled to the second trace.

9 . The sensor of claim 8 and further including a via connecting the second electrode to the second trace.

10 . The sensor of claim 2 wherein:
the sensing element includes a strain gauge; and
the conductor layer includes the first and second traces.

11 . A pressure/force sensor, comprising:
a circuit assembly including a diaphragm portion and a lead portion including:
an insulating layer;
a conductor layer including a sensor structure at the diaphragm portion and at least one trace at the lead portion that is connected to the sensor structure; and
a base, wherein the diaphragm portion of the circuit assembly is attached to the base.

12 . The sensor of claim 11 wherein the base includes a stainless steel member.

13 . The sensor of claim 12 wherein:
the stainless steel member of the base includes a moving portion; and
the diaphragm portion of the circuit assembly is attached to the base.

14 . The sensor of claim 13 wherein the stainless steel member of the base includes spring arms extending from the moving member.

Assignees

• Hutchinson Technology

Inventors

• Davis Michael W
• Ladwig Peter F
• Lang Matthew S
• Myers Dean E
• Olsen Clark T
• Riemer Douglas P

Classifications

• G01L1/2268 Primary

  Arrangements for correcting or for compensating unwanted effects · CPC title

• G01L1/146

  for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence) · CPC title