Shape memory alloy wire attachment structures for a suspension assembly

Patent metadata

Field	Value
Publication number	US-11782286-B2
Application number	US-201615063151-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Mar 6, 2015
Publication date	Oct 10, 2023
Grant date	Oct 10, 2023

Abstract

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.

First claim

What is claimed is:

1. A suspension assembly, comprising:
a support member configured as a one-piece metal base layer, wherein the one-piece metal base layer includes a plurality of attachment structures, the plurality of attachment structures includes a first attachment structure;
a moving member movably coupled to the support member, the moving member including a plate, wherein the plate includes a second attachment structure, the second attachment structure including:
a first portion including first elongated features being spaced apart by first spaces; and
a second portion configured to be crimped together with the first portion, the second portion including second elongated features being spaced apart by second spaces, and wherein the first spaces substantially align with the second elongated features and the first elongated features substantially align with the second spaces, wherein at least one of the first and second portions includes at least one etched recess pressed in the plate, a dielectric layer is disposed over the at least one etched recess pressed in the plate; and

a shape-memory alloy wire being coupled to the first attachment structure and the first and second portions.

2. The suspension assembly of claim 1 , wherein the first and second elongated features are formed from a conductive material.

3. The suspension assembly of claim 1 , wherein the first and second elongated features are formed from a dielectric.

4. The suspension assembly of claim 3 , further comprising: a first conductive layer disposed on the first elongated features and the first spaces and a second conductive layer disposed on the second elongated features and the second spaces.

5. The suspension assembly of claim 4 , wherein the first and second conductive layers are electrically coupled to the plate.

6. The suspension assembly of claim 4 , wherein the first and second conductive layers are a continuous conductive layer.

7. The suspension assembly of claim 1 , wherein the first portion includes etched recesses that receive the first elongated features and wherein the second portion includes etched recesses that receive the second elongated features.

8. The suspension assembly of claim 7 , wherein the etched recesses include rounded edges.

9. The suspension assembly of claim 1 , further including a member extended from at least one side of the first and second portions, wherein the shape-memory alloy wire is crimped by the member.

10. The suspension assembly of claim 1 , wherein the first and second portions are unitary with the plate.

11. The suspension assembly of claim 10 , wherein the plate includes a partial etched recess on an outer portion of a bend in the first and second portions when the first and second portions are crimped together.

12. The suspension assembly of claim 1 , wherein first and second portions are non-unitary and are coupled together using at least one of: an adhesive, a weld and a solder joint.

13. The suspension assembly of claim 1 , further comprising a shape-alloy wire cutting pad disposed on the plate.

14. A suspension assembly, comprising:
a support member configured as a one-piece metal base layer, wherein the one-piece metal base layer includes a first attachment structure extending from the support member;
a moving member movably coupled to the support member, the moving member including a plate, wherein the plate includes a second attachment structure, the second attachment structure including:
a first portion; and
a second portion configured to be crimped together with the first portion, wherein at least one of the first and second portions includes at least one etched recess pressed in the plate, a dielectric layer is disposed over the at least one etched recess pressed in the plate; and

a shape-memory alloy wire coupled to the first attachment structure and the first and second portions.

15. The suspension assembly of claim 14 , wherein both the first and second portions include at least one etched recess.

16. The suspension assembly of claim 14 , further comprising: a conductive layer disposed on the first and second portions.

17. The suspension assembly of claim 14 , wherein first and second portions are non-unitary and are coupled together using at least one of: an adhesive, a weld and a solder joint.

18. The suspension assembly of claim 14 , further including a member extended from at least one side of the first and second portions, wherein the shape-memory alloy wire is crimped by the member.

19. The suspension assembly of claim 14 , further comprising a shape-alloy wire cutting pad disposed on the plate.

20. The suspension assembly of claim 14 , wherein the etched recess includes an array of plural recesses.

21. The suspension assembly of claim 20 , wherein the plural recesses include at least one of the following patterns: an array of recesses, parallel zig-zags, parallel linear recesses.

22. A suspension assembly, comprising:
a support member configured as a one-piece metal base layer, wherein the one-piece metal base layer includes a first attachment structure;
a moving member movably coupled to the support member, the moving member including a plate, wherein the plate includes a second attachment structure, the second attachment structure including:
a first portion including first dielectric features being spaced apart by first spaces;
a second portion configured to be crimped together with the first portion, the second portion includes second dielectric features being spaced apart by second spaces; and
a member extending from at least one side of the first and second portions when the first and second portions are crimped together; and

a shape-memory alloy wire coupled to the first attachment structure, the first and second portions and a mechanical engagement member.

23. The suspension assembly of claim 22 , wherein the first and second portions include etched recesses.

24. The suspension assembly of claim 22 , wherein the first spaces substantially align with the second dielectric features and the first features substantially align with the second spaces.

25. The suspension assembly of claim 24 , wherein the member extending from at least one side of the first and second dielectric portions is unitary with at least one of the first or second dielectric features.

26. The suspension assembly of claim 24 , further comprising: a first conductive layer disposed on the first dielectric features and the first spaces and a second conductive layer disposed on the second dielectric features and the second spaces.

27. The suspension assembly of claim 26 , wherein the first and second conductive layers are electrically coupled to the plate.

28. The suspension assembly of claim 26 , wherein the first and second conductive layers is a continuous conductive layer.

29. The suspension assembly of claim 24 , wherein the first portion includes etched recesses that receive the first members and wherein the second portion includes etched recesses that receive the second members.

30. The suspension assembly of claim 23 , wherein the etched recesses include rounded edges.

31. The suspension assembly of claim 22 , wherein first and second portions are non-unitary and are coupled together using at least one of: an adhesive, a weld and a solder joint.

Assignees

• Hutchinson Technology

Inventors

• Ladwig Peter F
• Miller Mark A
• Davis Michael W
• Scheele Bryan J
• Riemer Douglas P
• Anderson Donald M
• Theget John A

Classifications

• F03G7/0665

  controlled displacement, e.g. by using a lens positioning actuator · CPC title

• F03G7/0616

  characterised by the material or the manufacturing process, e.g. the assembly (magnetic shape memory alloys F03G7/06147) · CPC title

• F03G7/06143

  Wires · CPC title

• G02B27/646 Primary

  compensating for small deviations, e.g. due to vibration or shake (movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68) · CPC title

• F03G7/065

  using a shape memory element · CPC title